summaryrefslogtreecommitdiff
path: root/arch/arm/boot/dts/exynos5422-odroidhc1.dts
AgeCommit message (Collapse)Author
2021-07-20ARM: dts: exynos: fix PWM LED max brightness on Odroid HC1Krzysztof Kozlowski
[ Upstream commit a7e59c84cf2055a1894f45855c8319191f2fa59e ] There is no "max_brightness" property as pointed out by dtschema: arch/arm/boot/dts/exynos5422-odroidhc1.dt.yaml: led-controller: led-1: 'max-brightness' is a required property Fixes: 1ac49427b566 ("ARM: dts: exynos: Add support for Hardkernel's Odroid HC1 board") Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Link: https://lore.kernel.org/r/20210505135941.59898-4-krzysztof.kozlowski@canonical.com Signed-off-by: Sasha Levin <sashal@kernel.org>
2018-11-18ARM: dts: exynos: Add all CPUs in cooling mapsViresh Kumar
Each CPU can (and does) participate in cooling down the system but the DT only captures a handful of them, normally CPU0, in the cooling maps. Things work by chance currently as under normal circumstances its the first CPU of each cluster which is used by the operating systems to probe the cooling devices. But as soon as this CPU ordering changes and any other CPU is used to bring up the cooling device, we will start seeing failures. Also the DT is rather incomplete when we list only one CPU in the cooling maps, as the hardware doesn't have any such limitations. Update cooling maps to include all devices affected by individual trip points. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
2018-01-03ARM: dts: exynos: Add SPDX license identifiersKrzysztof Kozlowski
Replace GPL v2.0 license statements with SPDX license identifiers. Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
2017-10-02ARM: dts: exynos: Add support for Hardkernel's Odroid HC1 boardMarek Szyprowski
Odroid HC1 board is based on Odroid XU4 board, but it has no HDMI, no eMMC, no built-in USB3.0 hub, no extension port pins, and no GPIO button. USB3.0 ports are used for built-in JMicron USB to SATA bridge and Gigabit R8152 ethernet chips. HC1 uses only passive cooling. Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com> Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>