The thermal sensor on K1 supports monitoring five temperature zones. The driver registers these sensors with the thermal framework and supports standard operations: - Reading temperature (millidegree Celsius) - Setting high/low thresholds for interrupts Signed-off-by: Shuwei Wu <shuwei.wu@mailbox.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> Reviewed-by: Anand Moon <linux.amoon@gmail.com> Reviewed-by: Troy Mitchell <troy.mitchell@linux.spacemit.com> Reviewed-by: Yao Zi <me@ziyao.cc> Tested-by: Anand Moon <linux.amoon@gmail.com> Tested-by: Vincent Legoll <legoll@online.fr> # OrangePi-RV2 Tested-by: Gong Shuai <gsh517025@gmail.com> Link: https://patch.msgid.link/20260427-k1-thermal-v5-2-df39187480ed@mailbox.org
The amlogic thermal driver calls meson_sm_get() and meson_sm_get_thermal_calib() which are exported by the meson_sm driver. Without CONFIG_MESON_SM enabled, the build fails with undefined references to these symbols. Add a proper Kconfig dependency on MESON_SM instead of relying on stub functions, which makes the dependency explicit and prevents invalid configurations. Closes: https://lore.kernel.org/oe-kbuild-all/202605291530.en7aGn7w-lkp@intel.com/ Reported-by: Mark Brown <broonie@kernel.org> Reported-by: kernel test robot <lkp@intel.com> Signed-off-by: Ronald Claveau <linux-kernel-dev@aliel.fr> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> Link: https://lore.kernel.org/oe-kbuild-all/202605291530.en7aGn7w-lkp@intel.com/ Link: https://patch.msgid.link/20260602-fix-missing-meson_sm-symbol-v3-1-6f7f69cd7d6c@aliel.fr
Introduce support for the i.MX91 thermal monitoring unit, which features a single sensor for the CPU. The register layout differs from other chips, necessitating the creation of a dedicated file for this. This sensor provides a resolution of 1/64°C (6-bit fraction). For actual accuracy, refer to the datasheet, as it varies depending on the chip grade. Provide an interrupt for end of measurement and threshold violation and Contain temperature threshold comparators, in normal and secure address space, with direction and threshold programmability. Datasheet Link: https://www.nxp.com/docs/en/data-sheet/IMX91CEC.pdf Signed-off-by: Pengfei Li <pengfei.li_1@nxp.com> Signed-off-by: Peng Fan <peng.fan@nxp.com> Signed-off-by: Frank Li <Frank.Li@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://patch.msgid.link/20251020-imx91tmu-v7-2-48d7d9f25055@nxp.com
Add support for Airoha EN7581 thermal sensor. This provide support for reading the CPU or SoC Package sensor and to setup trip points for hot and critical condition. An interrupt is fired to react on this and doesn't require passive poll to read the temperature. The thermal regs provide a way to read the ADC value from an external register placed in the Chip SCU regs. Monitor will read this value and fire an interrupt if the trip condition configured is reached. The Thermal Trip and Interrupt logic is conceptually similar to Mediatek LVTS Thermal but differ in register mapping and actual function/bug workaround. The implementation only share some register names but from functionality observation it's very different and used only for the basic function of periodically poll the temp and trip the interrupt. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20250511185003.3754495-2-ansuelsmth@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Enabling the compile test should not cause automatic enabling of all drivers, but only allow to choose to compile them. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/20250417074638.81329-1-krzysztof.kozlowski@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add a thermal cooling driver to provide path to access PCIe bandwidth controller using the usual thermal interfaces. A cooling device is instantiated for controllable PCIe Ports from the bwctrl service driver. If registering the cooling device fails, allow bwctrl's probe to succeed regardless. As cdev in that case contains IS_ERR() pseudo "pointer", clean that up inside the probe function so the remove side doesn't need to suddenly make an odd looking IS_ERR() check. The thermal side state 0 means no throttling, i.e., maximum supported PCIe Link Speed. Link: https://lore.kernel.org/r/20241018144755.7875-9-ilpo.jarvinen@linux.intel.com Signed-off-by: Ilpo Järvinen <ilpo.jarvinen@linux.intel.com> [bhelgaas: dropped data->cdev test per https://lore.kernel.org/r/ZzRm1SJTwEMRsAr8@wunner.de] Signed-off-by: Bjorn Helgaas <bhelgaas@google.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Acked-by: Rafael J. Wysocki <rafael@kernel.org> # From the cooling device interface perspective
Switch to thermal_of_zone to handle thermal-zones. Replace thermal_zone_device_register() by devm_thermal_of_zone_register() and remove ops st_thermal_get_trip_type, st_thermal_get_trip_temp. Signed-off-by: Raphael Gallais-Pou <rgallaispou@gmail.com> Link: https://lore.kernel.org/r/20240716-thermal-v4-2-947b327e165c@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Introduce a facility allowing the thermal core functionality to be exercised in a controlled way in order to verify its behavior, without affecting its regular users noticeably. It is based on the idea of preparing thermal zone templates along with their trip points by writing to files in debugfs. When ready, those templates can be used for registering test thermal zones with the thermal core. The temperature of a test thermal zone created this way can be adjusted via debugfs, which also triggers a __thermal_zone_device_update() call for it. By manipulating the temperature of a test thermal zone, one can check if the thermal core reacts to the changes of it as expected. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Link: https://patch.msgid.link/6065927.lOV4Wx5bFT@rjwysocki.net [ rjw: Fixed ordering of kcalloc() arguments ] [ rjw: Fixed debugfs_create_dir() return value checks ] [ rjw: Fixed two kerneldoc comments ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Move all Renesas thermal drivers to a vendor specific directory. All drivers are moved verbatim apart from the updated include path for thermal_hwmon.h. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20240506154011.344324-2-niklas.soderlund+renesas@ragnatech.se
The only difference made by CONFIG_THERMAL_WRITABLE_TRIPS is whether or not the writable trips mask passed during thermal zone registration will take any effect, but whoever passes a non-zero writable trips mask to thermal_zone_device_register_with_trips() can be forgiven thinking that it will always work. Moreover, some thermal drivers expect user space to set trip temperature values, so they select CONFIG_THERMAL_WRITABLE_TRIPS, possibly overriding a manual choice to unset it and going against the design purportedly allowing system integrators to decide on the writability of trip points for the given kernel build. It is also set in one platform's defconfig. Forthermore, CONFIG_THERMAL_WRITABLE_TRIPS only affects trip temperature, because trip hysteresis is writable as long as the thermal zone provides a callback to update it, regardless of the CONFIG_THERMAL_WRITABLE_TRIPS value. The above means that the symbol in question is used inconsistently and its purpose is at least moot, so remove it and always take the writable trip mask passed to thermal_zone_device_register_with_trips() into account. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>