linux-toradex.git/drivers/thermal/Makefile, branch v3.13

thermal: hwmon: move hwmon support to single file

2013-09-03T13:09:12+00:00

In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui 
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R 
Signed-off-by: Eduardo Valentin

Merge branches 'exynos', 'imx' and 'fixes' of .git into next

2013-08-15T07:25:27+00:00

thermal: exynos: Moving exynos thermal files into samsung directory

2013-08-13T13:51:59+00:00

This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.

Acked-by: Kukjin Kim 
Acked-by: Jonghwa Lee 
Acked-by: Eduardo Valentin 
Signed-off-by: Amit Daniel Kachhap 
Signed-off-by: Eduardo Valentin

thermal: add imx thermal driver support

2013-08-13T13:45:34+00:00

This is based on the initial imx thermal work done by
Rob Lee  (Not sure if the email address is still
valid).  Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs.  The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.

Signed-off-by: Shawn Guo 
Signed-off-by: Eduardo Valentin

Merge branch 'cpu-package-thermal' of .git into next

2013-06-17T22:31:26+00:00

Conflicts:
	drivers/thermal/Kconfig
	drivers/thermal/Makefile

Thermal: CPU Package temperature thermal

2013-06-17T22:27:47+00:00

This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.

Signed-off-by: Srinivas Pandruvada 
Signed-off-by: Zhang Rui

thermal: introduce TI SoC thermal driver

2013-05-28T02:40:37+00:00

This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely 
Cc: Rob Herring 
Cc: Rob Landley 
Cc: Greg Kroah-Hartman 
Cc: Zhang Rui 
Cc: Eduardo Valentin 
Cc: J Keerthy 
Cc: Radhesh Fadnis 
Cc: Cyril Roelandt 
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin 
Signed-off-by: Zhang Rui

Thermal: build cpu_cooling code into thermal_sys module

2013-04-14T15:28:49+00:00

Signed-off-by: Zhang Rui 
Acked-by: Eduardo Valentin 
Acked-by: Durgadoss R

Thermal: build thermal governors into thermal_sys module

2013-04-14T15:28:43+00:00

The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui 
Acked-by: Eduardo Valentin 
Acked-by: Durgadoss R

Thermal: rename thermal_sys.c to thermal_core.c

2013-04-13T18:14:12+00:00

this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.

No functional change in this patch.

Signed-off-by: Zhang Rui 
Acked-by: Eduardo Valentin 
Acked-by: Durgadoss R