<feed xmlns='http://www.w3.org/2005/Atom'>
<title>linux-toradex.git/drivers/thermal/Makefile, branch v3.7-rc7</title>
<subtitle>Linux kernel for Apalis and Colibri modules</subtitle>
<link rel='alternate' type='text/html' href='https://git.toradex.cn/cgit/linux-toradex.git/'/>
<entry>
<title>hwmon: exynos4: move thermal sensor driver to driver/thermal directory</title>
<updated>2012-09-24T06:44:38+00:00</updated>
<author>
<name>Amit Daniel Kachhap</name>
<email>amit.kachhap@linaro.org</email>
</author>
<published>2012-08-16T11:41:41+00:00</published>
<link rel='alternate' type='text/html' href='https://git.toradex.cn/cgit/linux-toradex.git/commit/?id=c48cbba6fee3587bdfe77ef850a1a0aa30a2a60f'/>
<id>c48cbba6fee3587bdfe77ef850a1a0aa30a2a60f</id>
<content type='text'>
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap &lt;amit.kachhap@linaro.org&gt;
Acked-by: Guenter Roeck &lt;guenter.roeck@ericsson.com&gt;
Cc: SangWook Ju &lt;sw.ju@samsung.com&gt;
Cc: Durgadoss &lt;durgadoss.r@intel.com&gt;
Cc: Len Brown &lt;lenb@kernel.org&gt;
Cc: Jean Delvare &lt;khali@linux-fr.org&gt;
Cc: Kyungmin Park &lt;kmpark@infradead.org&gt;
Cc: Kukjin Kim &lt;kgene.kim@samsung.com&gt;
Signed-off-by: Andrew Morton &lt;akpm@linux-foundation.org&gt;
Signed-off-by: Amit Daniel Kachhap &lt;amit.daniel@samsung.com&gt;
Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
</content>
<content type='xhtml'>
<div xmlns='http://www.w3.org/1999/xhtml'>
<pre>
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap &lt;amit.kachhap@linaro.org&gt;
Acked-by: Guenter Roeck &lt;guenter.roeck@ericsson.com&gt;
Cc: SangWook Ju &lt;sw.ju@samsung.com&gt;
Cc: Durgadoss &lt;durgadoss.r@intel.com&gt;
Cc: Len Brown &lt;lenb@kernel.org&gt;
Cc: Jean Delvare &lt;khali@linux-fr.org&gt;
Cc: Kyungmin Park &lt;kmpark@infradead.org&gt;
Cc: Kukjin Kim &lt;kgene.kim@samsung.com&gt;
Signed-off-by: Andrew Morton &lt;akpm@linux-foundation.org&gt;
Signed-off-by: Amit Daniel Kachhap &lt;amit.daniel@samsung.com&gt;
Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
</pre>
</div>
</content>
</entry>
<entry>
<title>thermal: add generic cpufreq cooling implementation</title>
<updated>2012-09-24T06:44:38+00:00</updated>
<author>
<name>Amit Daniel Kachhap</name>
<email>amit.kachhap@linaro.org</email>
</author>
<published>2012-08-16T11:41:40+00:00</published>
<link rel='alternate' type='text/html' href='https://git.toradex.cn/cgit/linux-toradex.git/commit/?id=023614183768a7ac62898bded5ec6c0c9fecbdd9'/>
<id>023614183768a7ac62898bded5ec6c0c9fecbdd9</id>
<content type='text'>
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal &lt;-----&gt;  Exynos thermal interface &lt;----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device &lt;---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap &lt;amit.kachhap@linaro.org&gt;
Cc: Guenter Roeck &lt;guenter.roeck@ericsson.com&gt;
Cc: SangWook Ju &lt;sw.ju@samsung.com&gt;
Cc: Durgadoss &lt;durgadoss.r@intel.com&gt;
Cc: Len Brown &lt;lenb@kernel.org&gt;
Cc: Jean Delvare &lt;khali@linux-fr.org&gt;
Cc: Kyungmin Park &lt;kmpark@infradead.org&gt;
Cc: Kukjin Kim &lt;kgene.kim@samsung.com&gt;
Signed-off-by: Andrew Morton &lt;akpm@linux-foundation.org&gt;
Signed-off-by: Amit Daniel Kachhap &lt;amit.daniel@samsung.com&gt;
Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
</content>
<content type='xhtml'>
<div xmlns='http://www.w3.org/1999/xhtml'>
<pre>
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal &lt;-----&gt;  Exynos thermal interface &lt;----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device &lt;---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap &lt;amit.kachhap@linaro.org&gt;
Cc: Guenter Roeck &lt;guenter.roeck@ericsson.com&gt;
Cc: SangWook Ju &lt;sw.ju@samsung.com&gt;
Cc: Durgadoss &lt;durgadoss.r@intel.com&gt;
Cc: Len Brown &lt;lenb@kernel.org&gt;
Cc: Jean Delvare &lt;khali@linux-fr.org&gt;
Cc: Kyungmin Park &lt;kmpark@infradead.org&gt;
Cc: Kukjin Kim &lt;kgene.kim@samsung.com&gt;
Signed-off-by: Andrew Morton &lt;akpm@linux-foundation.org&gt;
Signed-off-by: Amit Daniel Kachhap &lt;amit.daniel@samsung.com&gt;
Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
</pre>
</div>
</content>
</entry>
<entry>
<title>thermal: add Renesas R-Car thermal sensor support</title>
<updated>2012-09-24T06:44:37+00:00</updated>
<author>
<name>Kuninori Morimoto</name>
<email>kuninori.morimoto.gx@renesas.com</email>
</author>
<published>2012-07-21T00:53:48+00:00</published>
<link rel='alternate' type='text/html' href='https://git.toradex.cn/cgit/linux-toradex.git/commit/?id=1e426ffddf2f158367eb6c7b8eb563c814a43283'/>
<id>1e426ffddf2f158367eb6c7b8eb563c814a43283</id>
<content type='text'>
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto &lt;kuninori.morimoto.gx@renesas.com&gt;
Cc: Len Brown &lt;len.brown@intel.com&gt;
Cc: Joe Perches &lt;joe@perches.com&gt;
Cc: Jean Delvare &lt;khali@linux-fr.org&gt;
Cc: Guenter Roeck &lt;guenter.roeck@ericsson.com&gt;
Cc: Magnus Damm &lt;magnus.damm@gmail.com&gt;
Signed-off-by: Andrew Morton &lt;akpm@linux-foundation.org&gt;
Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
</content>
<content type='xhtml'>
<div xmlns='http://www.w3.org/1999/xhtml'>
<pre>
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto &lt;kuninori.morimoto.gx@renesas.com&gt;
Cc: Len Brown &lt;len.brown@intel.com&gt;
Cc: Joe Perches &lt;joe@perches.com&gt;
Cc: Jean Delvare &lt;khali@linux-fr.org&gt;
Cc: Guenter Roeck &lt;guenter.roeck@ericsson.com&gt;
Cc: Magnus Damm &lt;magnus.damm@gmail.com&gt;
Signed-off-by: Andrew Morton &lt;akpm@linux-foundation.org&gt;
Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
</pre>
</div>
</content>
</entry>
<entry>
<title>thermal: add support for thermal sensor present on SPEAr13xx machines</title>
<updated>2012-03-22T05:05:32+00:00</updated>
<author>
<name>Vincenzo Frascino</name>
<email>vincenzo.frascino@st.com</email>
</author>
<published>2012-03-21T19:55:03+00:00</published>
<link rel='alternate' type='text/html' href='https://git.toradex.cn/cgit/linux-toradex.git/commit/?id=6a92c36688bd6d8e68e19ca9b5e41e8197921b59'/>
<id>6a92c36688bd6d8e68e19ca9b5e41e8197921b59</id>
<content type='text'>
ST's SPEAr13xx machines are based on CortexA9 ARM processors.  These
machines contain a thermal sensor for junction temperature monitoring.

This patch adds support for this thermal sensor in existing thermal
framework.

[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino &lt;vincenzo.frascino@st.com&gt;
Signed-off-by: Viresh Kumar &lt;viresh.kumar@st.com&gt;
Signed-off-by: Viresh Kumar &lt;viresh.kumar@st.com&gt;
Signed-off-by: Andrew Morton &lt;akpm@linux-foundation.org&gt;
Signed-off-by: Len Brown &lt;len.brown@intel.com&gt;
</content>
<content type='xhtml'>
<div xmlns='http://www.w3.org/1999/xhtml'>
<pre>
ST's SPEAr13xx machines are based on CortexA9 ARM processors.  These
machines contain a thermal sensor for junction temperature monitoring.

This patch adds support for this thermal sensor in existing thermal
framework.

[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino &lt;vincenzo.frascino@st.com&gt;
Signed-off-by: Viresh Kumar &lt;viresh.kumar@st.com&gt;
Signed-off-by: Viresh Kumar &lt;viresh.kumar@st.com&gt;
Signed-off-by: Andrew Morton &lt;akpm@linux-foundation.org&gt;
Signed-off-by: Len Brown &lt;len.brown@intel.com&gt;
</pre>
</div>
</content>
</entry>
<entry>
<title>thermal: re-name thermal.c to thermal_sys.c</title>
<updated>2008-04-29T07:12:17+00:00</updated>
<author>
<name>Len Brown</name>
<email>len.brown@intel.com</email>
</author>
<published>2008-04-29T07:12:17+00:00</published>
<link rel='alternate' type='text/html' href='https://git.toradex.cn/cgit/linux-toradex.git/commit/?id=ff16cab69b6ed621686cf342306785175775152d'/>
<id>ff16cab69b6ed621686cf342306785175775152d</id>
<content type='text'>
thermal_sys was already the name of the resulting module,
and it is built from  this one source file.

Signed-off-by: Len Brown &lt;len.brown@intel.com&gt;
</content>
<content type='xhtml'>
<div xmlns='http://www.w3.org/1999/xhtml'>
<pre>
thermal_sys was already the name of the resulting module,
and it is built from  this one source file.

Signed-off-by: Len Brown &lt;len.brown@intel.com&gt;
</pre>
</div>
</content>
</entry>
<entry>
<title>thermal: add the support for building the generic thermal as a module</title>
<updated>2008-04-29T06:44:00+00:00</updated>
<author>
<name>Zhang Rui</name>
<email>rui.zhang@intel.com</email>
</author>
<published>2008-04-21T08:07:13+00:00</published>
<link rel='alternate' type='text/html' href='https://git.toradex.cn/cgit/linux-toradex.git/commit/?id=63c4ec905d63834a97ec7dbbf0a2ec89ef5872be'/>
<id>63c4ec905d63834a97ec7dbbf0a2ec89ef5872be</id>
<content type='text'>
Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
Acked-by: Jean Delvare &lt;khali@linux-fr.org&gt;
Signed-off-by: Len Brown &lt;len.brown@intel.com&gt;
</content>
<content type='xhtml'>
<div xmlns='http://www.w3.org/1999/xhtml'>
<pre>
Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
Acked-by: Jean Delvare &lt;khali@linux-fr.org&gt;
Signed-off-by: Len Brown &lt;len.brown@intel.com&gt;
</pre>
</div>
</content>
</entry>
<entry>
<title>the generic thermal sysfs driver</title>
<updated>2008-02-02T04:12:19+00:00</updated>
<author>
<name>Zhang Rui</name>
<email>rui.zhang@intel.com</email>
</author>
<published>2008-01-17T07:51:08+00:00</published>
<link rel='alternate' type='text/html' href='https://git.toradex.cn/cgit/linux-toradex.git/commit/?id=203d3d4aa482339b4816f131f713e1b8ee37f6dd'/>
<id>203d3d4aa482339b4816f131f713e1b8ee37f6dd</id>
<content type='text'>
The Generic Thermal sysfs driver for thermal management.

Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
Signed-off-by: Thomas Sujith &lt;sujith.thomas@intel.com&gt;
Signed-off-by: Len Brown &lt;len.brown@intel.com&gt;
</content>
<content type='xhtml'>
<div xmlns='http://www.w3.org/1999/xhtml'>
<pre>
The Generic Thermal sysfs driver for thermal management.

Signed-off-by: Zhang Rui &lt;rui.zhang@intel.com&gt;
Signed-off-by: Thomas Sujith &lt;sujith.thomas@intel.com&gt;
Signed-off-by: Len Brown &lt;len.brown@intel.com&gt;
</pre>
</div>
</content>
</entry>
</feed>
