linux-toradex.git/drivers/thermal/Makefile, branch v5.8 Linux kernel for Apalis and Colibri modules thermal/of: Rename of-thermal.c 2020-05-22T16:48:54+00:00 Amit Kucheria amit.kucheria@linaro.org 2020-05-11T12:25:02+00:00 14adf6c83f7c6953a136d9d4beda79004191e729 Core thermal framework code files should start with thermal_*. of-thermal.c does not follow this pattern and can easily be confused with platform driver. Fix this by renaming it to thermal_of.c Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/f5e233d5c5dcc7c7cb56b3448da255cb2c9ef0d1.1589199124.git.amit.kucheria@linaro.org 
Core thermal framework code files should start with thermal_*.
of-thermal.c does not follow this pattern and can easily be confused
with platform driver.

Fix this by renaming it to thermal_of.c

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/f5e233d5c5dcc7c7cb56b3448da255cb2c9ef0d1.1589199124.git.amit.kucheria@linaro.org
thermal/governors: Prefix all source files with gov_ 2020-05-22T16:48:54+00:00 Amit Kucheria amit.kucheria@linaro.org 2020-05-11T12:25:01+00:00 0015d9a2a72745308ef9728a746ff7b1e82138bc Bang-bang governor source file is prefixed with gov_. Do the same for other governors for consistency so they're easy to find in the sources. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/b9a85d3204712f14e320504948c12712dc0b291b.1589199124.git.amit.kucheria@linaro.org 
Bang-bang governor source file is prefixed with gov_. Do the same for
other governors for consistency so they're easy to find in the sources.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/b9a85d3204712f14e320504948c12712dc0b291b.1589199124.git.amit.kucheria@linaro.org
thermal: k3: Add support for bandgap sensors 2020-04-14T09:41:12+00:00 Keerthy j-keerthy@ti.com 2020-04-07T05:51:14+00:00 48b2bce8c7db92601145e1204fa7048b1f74e442 Add VTM thermal support. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Currently reading temperatures only is supported. There are no active/passive cooling agent supported. Signed-off-by: Keerthy <j-keerthy@ti.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com 
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported.  There are no
active/passive cooling agent supported.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit 2020-03-12T10:56:53+00:00 Anson Huang Anson.Huang@nxp.com 2020-02-29T03:44:20+00:00 5eed800a68116a3cc66731162f7ea431d2732d4c i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one sensor for CPU, add support for reading immediate temperature of this sensor. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com 
i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
this sensor.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
thermal: imx_sc: add i.MX system controller thermal support 2020-03-12T10:40:57+00:00 Anson Huang Anson.Huang@nxp.com 2020-02-22T00:08:50+00:00 e20db70dba1c0783b9878ce37171ad560b1ebaf3 i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller inside, the system controller is in charge of controlling power, clock and thermal sensors etc.. This patch adds i.MX system controller thermal driver support, Linux kernel has to communicate with system controller via MU (message unit) IPC to get each thermal sensor's temperature, it supports multiple sensors which are passed from device tree, please see the binding doc for details. Signed-off-by: Anson Huang <Anson.Huang@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com 
i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller
inside, the system controller is in charge of controlling power,
clock and thermal sensors etc..

This patch adds i.MX system controller thermal driver support,
Linux kernel has to communicate with system controller via MU
(message unit) IPC to get each thermal sensor's temperature,
it supports multiple sensors which are passed from device tree,
please see the binding doc for details.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
thermal: sprd: Add Spreadtrum thermal driver support 2020-03-12T10:40:57+00:00 Freeman Liu freeman.liu@unisoc.com 2020-02-18T08:10:28+00:00 554fdbaf19b188224d52d2fa80c049e4d42002e8 This patch adds the support for Spreadtrum thermal sensor controller, which can support maximum 8 sensors. Signed-off-by: Freeman Liu <freeman.liu@unisoc.com> Co-developed-with: Baolin Wang <baolin.wang@unisoc.com> Signed-off-by: Baolin Wang <baolin.wang7@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com 
This patch adds the support for Spreadtrum thermal sensor controller,
which can support maximum 8 sensors.

Signed-off-by: Freeman Liu <freeman.liu@unisoc.com>
Co-developed-with: Baolin Wang <baolin.wang@unisoc.com>
Signed-off-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com
thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40 2020-01-27T09:24:32+00:00 Yangtao Li tiny.windzz@gmail.com 2019-12-19T17:28:17+00:00 dccc5c3b6f30f27ed0f1bea82221e18face20bef This patch adds the support for allwinner thermal sensor, within allwinner SoC. It will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Yangtao Li <tiny.windzz@gmail.com> Signed-off-by: Ondrej Jirman <megous@megous.com> Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com> Acked-by: Maxime Ripard <mripard@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com 
This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
thermal/drivers/cpu_cooling: Rename to cpufreq_cooling 2020-01-27T09:24:32+00:00 Daniel Lezcano daniel.lezcano@linaro.org 2019-12-19T22:53:17+00:00 23affa2e29c5faa8cb59778f71e3bce2c8b3aa5c As we introduced the idle injection cooling device called cpuidle_cooling, let's be consistent and rename the cpu_cooling to cpufreq_cooling as this one mitigates with OPPs changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org 
As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver 2020-01-27T09:24:32+00:00 Daniel Lezcano daniel.lezcano@linaro.org 2019-12-19T22:53:16+00:00 a4c428e523490bf53e9c4ba2d809130c58c06ac7 The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org 
The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.

It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.

The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.

An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.

With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
thermal/drivers/Kconfig: Convert the CPU cooling device to a choice 2020-01-27T09:24:32+00:00 Daniel Lezcano daniel.lezcano@linaro.org 2019-12-04T15:39:27+00:00 2b586feab44f41db605924db15c5b039535b1f9b The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org 
The next changes will add a new way to cool down a CPU by injecting
idle cycles. With the current configuration, a CPU cooling device is
the cpufreq cooling device. As we want to add a new CPU cooling
device, let's convert the CPU cooling to a choice giving a list of CPU
cooling devices. At this point, there is obviously only one CPU
cooling device.

There is no functional changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org