linux-toradex.git/include/dt-bindings/interconnect, branch v5.16 Linux kernel for Apalis and Colibri modules dt-bindings: interconnect: Add Qualcomm SC8180x DT bindings 2021-08-09T12:16:31+00:00 Georgi Djakov georgi.djakov@linaro.org 2021-07-23T19:42:42+00:00 d81274f8fd8616724a86be0b9bab92f0f52651ef Add compatibles and port definitions for the SC8180x RPMH interconnect providers. Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> [bjorn: Split defines from driver patch and added binding update] Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210723194243.3675795-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org> 
Add compatibles and port definitions for the SC8180x RPMH interconnect
providers.

Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
[bjorn: Split defines from driver patch and added binding update]
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210723194243.3675795-1-bjorn.andersson@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Add Qualcomm SC7280 DT bindings 2021-05-11T08:52:59+00:00 Odelu Kukatla okukatla@codeaurora.org 2021-04-27T09:50:56+00:00 0b889618939f28bf447a1618f997243f82c7ff9a The Qualcomm SC7280 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1619517059-12109-2-git-send-email-okukatla@codeaurora.org Signed-off-by: Georgi Djakov <djakov@kernel.org> 
The Qualcomm SC7280 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1619517059-12109-2-git-send-email-okukatla@codeaurora.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Merge branch 'icc-sm8350' into icc-next 2021-04-02T10:12:37+00:00 Georgi Djakov georgi.djakov@linaro.org 2021-04-02T10:12:37+00:00 c1de07884f2bafa11ad3780cf08b234c88c2cc9d This adds interconnect support for SM8350 SoC. * icc-sm8350 dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings interconnect: qcom: Add SM8350 interconnect provider driver interconnect: qcom: sm8350: Use the correct ids interconnect: qcom: sm8350: Add missing link between nodes Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> 
This adds interconnect support for SM8350 SoC.

* icc-sm8350
  dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings
  interconnect: qcom: Add SM8350 interconnect provider driver
  interconnect: qcom: sm8350: Use the correct ids
  interconnect: qcom: sm8350: Add missing link between nodes

Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings 2021-03-27T12:33:37+00:00 Vinod Koul vkoul@kernel.org 2021-03-18T09:46:16+00:00 c009ffe661f68236deb37c91fa1c1c82e9ecdd9c The Qualcomm SM8350 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Vinod Koul <vkoul@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> 
The Qualcomm SM8350 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Vinod Koul <vkoul@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoC 2021-03-08T13:09:45+00:00 AngeloGioacchino Del Regno kholk11@gmail.com 2021-03-08T13:09:45+00:00 33ad2800348e6c20f05b86ef01e8216fc3e3c762 Add the bindings for the Qualcomm SDM660-class NoC, valid for SDM630, SDM636, SDM660 and SDA variants. Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> 
Add the bindings for the Qualcomm SDM660-class NoC, valid for
SDM630, SDM636, SDM660 and SDA variants.

Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Merge branch 'icc-sdx55' into icc-next 2021-02-01T12:26:57+00:00 Georgi Djakov georgi.djakov@linaro.org 2021-02-01T12:26:57+00:00 6715ea06ced45c8910c878877722ccf502301499 Add interconnect driver support for SDX55 platform for scaling the bandwidth requirements over RPMh. * icc-sdx55 dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings interconnect: qcom: Add SDX55 interconnect provider driver Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> 
Add interconnect driver support for SDX55 platform for scaling the
bandwidth requirements over RPMh.

* icc-sdx55
  dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings
  interconnect: qcom: Add SDX55 interconnect provider driver

Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings 2021-01-27T11:11:33+00:00 Manivannan Sadhasivam manivannan.sadhasivam@linaro.org 2021-01-27T11:11:33+00:00 acda36189cb8df27ef073d391ebd67c64ac36cf9 The Qualcomm SDX55 platform has several bus fabrics that could be controlled and tuned dynamically over RPMh according to the bandwidth demand. Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> 
The Qualcomm SDX55 platform has several bus fabrics that could be
controlled and tuned dynamically over RPMh according to the bandwidth
demand.

Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
dt-bindings: interconnect: Add Qualcomm MSM8939 DT bindings 2021-01-05T11:10:38+00:00 Jun Nie jun.nie@linaro.org 2020-12-04T07:53:44+00:00 4ec908d2104026c67e4eb0fee722ed6893622763 The Qualcomm MSM8939 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jun Nie <jun.nie@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> 
The Qualcomm MSM8939 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Jun Nie <jun.nie@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
dt-bindings: interconnect: sdm845: Add IDs for the QUP ports 2020-11-30T16:42:47+00:00 Georgi Djakov georgi.djakov@linaro.org 2020-11-05T13:52:09+00:00 8742bb4bf203814b09572b615b5aeab000bf6248 The QUP ports exist in the topology, but are not exposed as an endpoints in DT. Fix this by creating IDs and attach them to their NoCs, so that the various QUP drivers (i2c/spi/uart etc.) are able to request their interconnect paths and scale their bandwidth. Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Link: https://lore.kernel.org/r/20201105135211.7160-1-georgi.djakov@linaro.org Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> 
The QUP ports exist in the topology, but are not exposed as an
endpoints in DT. Fix this by creating IDs and attach them to their
NoCs, so that the various QUP drivers (i2c/spi/uart etc.) are able
to request their interconnect paths and scale their bandwidth.

Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Link: https://lore.kernel.org/r/20201105135211.7160-1-georgi.djakov@linaro.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250 2020-09-08T13:29:01+00:00 Sibi Sankar sibis@codeaurora.org 2020-09-08T13:29:01+00:00 c4877059e0a4b88b59bc208f2608dc489553cf29 Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250 SoCs. Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> 
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250
SoCs.

Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>