linux-toradex.git/include/dt-bindings/interconnect, branch v6.9-rc4 Linux kernel for Apalis and Colibri modules Merge branch 'icc-sm7150' into icc-next 2024-02-29T20:43:01+00:00 Georgi Djakov djakov@kernel.org 2024-02-29T20:43:01+00:00 d1c16491134c726a78dd6936034f117acdc57185 Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC. * icc-sm7150 dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings interconnect: qcom: Add SM7150 driver support Link: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org> 
Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC.

* icc-sm7150
  dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings
  interconnect: qcom: Add SM7150 driver support

Link: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings 2024-02-29T20:42:19+00:00 Danila Tikhonov danila@jiaxyga.com 2024-02-22T17:42:49+00:00 9c4058493b62f5ee7a0620e21d21592283c8f8f5 The Qualcomm SM7150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Danila Tikhonov <danila@jiaxyga.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org> 
The Qualcomm SM7150 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Danila Tikhonov <danila@jiaxyga.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Merge branch 'icc-cleanup' into icc-next 2024-02-25T22:42:03+00:00 Georgi Djakov djakov@kernel.org 2024-02-25T22:42:03+00:00 6025a81ae63e7796479755e31a4f7b20786c1a5f * icc-cleanup interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes dt-bindings: interconnect: Remove bogus interconnect nodes interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes interconnect: qcom: sa8775p: constify pointer to qcom_icc_node interconnect: qcom: sm8250: constify pointer to qcom_icc_node interconnect: qcom: sm6115: constify pointer to qcom_icc_node interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address interconnect: constify of_phandle_args in xlate Signed-off-by: Georgi Djakov <djakov@kernel.org> 
* icc-cleanup
  interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes
  dt-bindings: interconnect: Remove bogus interconnect nodes
  interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes
  interconnect: qcom: sa8775p: constify pointer to qcom_icc_node
  interconnect: qcom: sm8250: constify pointer to qcom_icc_node
  interconnect: qcom: sm6115: constify pointer to qcom_icc_node
  interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm
  interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm
  dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address
  interconnect: constify of_phandle_args in xlate

Signed-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Remove bogus interconnect nodes 2024-01-31T13:48:19+00:00 Konrad Dybcio konrad.dybcio@linaro.org 2024-01-10T13:16:26+00:00 e92c9326743776ee2ffc6b933b7905c439872571 The downstream kernel has infrastructure for passing votes from different interconnect nodes onto different RPMh RSCs. This neither implemented, not is going to be implemented upstream (in favor of a different solution using ICC tags through the same node). Unfortunately, as it happens, meaningless (in the upstream context) parts of the vendor driver were copied, ending up causing havoc - since all "per-RSC" (in quotes because they all point to the main APPS one) BCMs defined within the driver overwrite the value in RPMh on every aggregation. To both avoid keeping bogus code around and possibly introducing impossible-to-track-down bugs (busses shutting down for no reason), get rid of the duplicated ICC node definitions. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240102-topic-x1e_fixes-v1-2-70723e08d5f6@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org> 
The downstream kernel has infrastructure for passing votes from different
interconnect nodes onto different RPMh RSCs. This neither implemented, not
is going to be implemented upstream (in favor of a different solution
using ICC tags through the same node).

Unfortunately, as it happens, meaningless (in the upstream context) parts
of the vendor driver were copied, ending up causing havoc - since all
"per-RSC" (in quotes because they all point to the main APPS one) BCMs
defined within the driver overwrite the value in RPMh on every
aggregation.

To both avoid keeping bogus code around and possibly introducing
impossible-to-track-down bugs (busses shutting down for no reason), get
rid of the duplicated ICC node definitions.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240102-topic-x1e_fixes-v1-2-70723e08d5f6@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindings 2024-01-31T13:08:46+00:00 Adam Skladowski a39.skl@gmail.com 2023-12-20T10:38:49+00:00 47878b451216cf5e5a23bb3f931a9f932464e93d Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices. [Stephan: Drop separate mm-snoc that exists downstream since it's actually the same NoC as SNoC in hardware] Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.com Signed-off-by: Georgi Djakov <djakov@kernel.org> 
Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices.

[Stephan: Drop separate mm-snoc that exists downstream since it's
 actually the same NoC as SNoC in hardware]

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Merge branch 'icc-sm6115' of https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into HEAD 2023-12-17T05:18:16+00:00 Bjorn Andersson andersson@kernel.org 2023-12-17T05:18:16+00:00 ea0b1a4c5a6ff1338ccffb8aad1ababf42d7bb0d Merge the SM6115 interconnect binding to allow referecing the interconnect header files and the ports defined in these. 
Merge the SM6115 interconnect binding to allow referecing the
interconnect header files and the ports defined in these.
Merge branch 'icc-x1e80100' of https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into arm64-for-6.8 2023-12-08T04:24:09+00:00 Bjorn Andersson andersson@kernel.org 2023-12-08T04:24:09+00:00 779266b127c83334cad14e1c7cbb17acad87ae9f Merge the X1E80100 interconnect binding to get access to the interconnect port constants. 
Merge the X1E80100 interconnect binding to get access to the
interconnect port constants.
dt-bindings: interconnect: Add Qualcomm SM6115 NoC 2023-12-06T15:16:07+00:00 Konrad Dybcio konrad.dybcio@linaro.org 2023-11-29T14:41:01+00:00 658902913c7044ac5d56b14cea54e735a071fe41 Add bindings for Qualcomm SM6115 Network-On-Chip interconnect. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-1-bd8907b8cfd7@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org> 
Add bindings for Qualcomm SM6115 Network-On-Chip interconnect.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-1-bd8907b8cfd7@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: Add Qualcomm X1E80100 SoC 2023-11-23T22:24:07+00:00 Rajendra Nayak quic_rjendra@quicinc.com 2023-11-23T13:50:27+00:00 dc84a76f054c01cc1d769a86ffa3a7e13867915a The Qualcomm X1E80100 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Co-developed-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com> Co-developed-by: Sibi Sankar <quic_sibis@quicinc.com> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231123135028.29433-2-quic_sibis@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org> 
The Qualcomm X1E80100 SoC has several bus fabrics that could be controlled
and tuned dynamically according to the bandwidth demand.

Co-developed-by: Abel Vesa <abel.vesa@linaro.org>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com>
Co-developed-by: Sibi Sankar <quic_sibis@quicinc.com>
Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231123135028.29433-2-quic_sibis@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm SM8650 SoC 2023-11-23T22:14:52+00:00 Neil Armstrong neil.armstrong@linaro.org 2023-11-23T13:32:12+00:00 80abebd9bf72516a3a6ed50f69908b9dbbf72a93 Document the RPMh Network-On-Chip Interconnect of the SM8650 platform. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Link: https://lore.kernel.org/r/20231123-topic-sm8650-upstream-interconnect-v2-1-7e050874f59b@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org> 
Document the RPMh Network-On-Chip Interconnect of the SM8650 platform.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://lore.kernel.org/r/20231123-topic-sm8650-upstream-interconnect-v2-1-7e050874f59b@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>