linux-toradex.git/include/linux/platform_data/dwc3-exynos.h, branch v3.13-rc8 Linux kernel for Apalis and Colibri modules usb: dwc3: Add Exynos Specific Glue layer 2012-03-02T10:11:28+00:00 Anton Tikhomirov av.tikhomirov@samsung.com 2012-02-15T08:04:56+00:00 d28a9689c93195d39f91f35a9519876688605b65 Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> 
Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
	on platforms which don't provide clk API implementation ]

Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>