linux-toradex.git/include/linux/thermal.h, branch v3.14.3

thermal: core: introduce thermal_of_cooling_device_register

2013-12-04T13:31:34+00:00

This patch adds a new API to allow registering cooling devices
in the thermal framework derived from device tree nodes.

This API links the cooling device with the device tree node
so that binding with thermal zones is possible, given
that thermal zones are pointing to cooling device
device tree nodes.

Cc: Zhang Rui 
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin

thermal: introduce device tree parser

2013-12-04T13:31:34+00:00

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui 
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland 
Signed-off-by: Eduardo Valentin

thermal: thermal_core: allow binding with limits on bind_params

2013-09-03T13:10:24+00:00

When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui 
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin

drivers: thermal: make usage of CONFIG_THERMAL_HWMON optional

2013-09-03T13:10:11+00:00

When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.

This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.

In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.

Cc: David Woodhouse 
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui 
Suggested-by: Wei Ni 
Signed-off-by: Eduardo Valentin

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

2013-05-09T16:40:49+00:00

Pull thermal management update from Zhang Rui:
 "The most important one is to build thermal core and governor and cpu
  cooling code into one module.  This fixes a regression that thermal
  core does not work if it is built as module, since 3.7.  I'll backport
  them to stable kernel once those changes are in upstream.

  The largest batch is the thermal kernel-doc & coding style
  updates/cleanups from Eduardo.

  Highlights:

   - build all thermal framework code into one module to fix a
     regression that thermal does not work if it is built as module.

   - Marvell Armada 370/XP thermal sensor driver

   - thermal core/cpu cooling kernel-doc & coding style updates and
     cleanups.

   - Add Eduardo Valentin as thermal sub-maintainer, both in mailing
     list and patchwork.  He will help me on arm thermal drivers."

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (68 commits)
  thermal: db8500_cpufreq_cooling: remove usage of IS_ERR_OR_NULL()
  thermal: thermal_core: remove usage of IS_ERR_OR_NULL
  thermal: cpu_cooling: improve line breaking
  thermal: cpu_cooling: alignment improvements
  thermal: cpu_cooling: remove checkpatch.pl warning
  thermal: cpu_cooling: remove trailing blank line
  thermal: cpu_cooling: align on open parenthesis
  thermal: cpu_cooling: standardize comment style
  thermal: cpu_cooling: standardize end of function
  thermal: cpu_cooling: remove trailing white spaces
  Thermal: update documentation for thermal_zone_device_register
  thermal: update kernel-doc for thermal_zone_device_register
  thermal: update kernel-doc for create_trip_attrs
  thermal: update kernel-doc for thermal_cooling_device_register
  thermal: update kernel-doc for thermal_zone_unbind_cooling_device
  thermal: update kernel-doc for thermal_zone_bind_cooling_device
  thermal: use EXPORT_SYMBOL_GPL
  thermal: rename notify_thermal_framework to thermal_notify_framework
  thermal: update driver license
  thermal: use strlcpy instead of strcpy
  ...

thermal: rename notify_thermal_framework to thermal_notify_framework

2013-04-24T16:56:16+00:00

To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.

Signed-off-by: Eduardo Valentin 
Signed-off-by: Zhang Rui

thermal: expose thermal_zone_get_temp API

2013-04-15T01:39:02+00:00

This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.

Acked-by: Durgadoss R 
Signed-off-by: Eduardo Valentin 
Signed-off-by: Zhang Rui

thermal: introduce thermal_zone_get_zone_by_name helper function

2013-04-15T01:34:28+00:00

This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.

It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).

Cc: Durgadoss R 
Signed-off-by: Eduardo Valentin 
Acked-by: Durgadoss R 
Signed-off-by: Zhang Rui

Merge branch 'thermal' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into next

2013-04-15T01:26:58+00:00

Conflicts:
	drivers/thermal/cpu_cooling.c

Thermal: build thermal governors into thermal_sys module

2013-04-14T15:28:43+00:00

The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui 
Acked-by: Eduardo Valentin 
Acked-by: Durgadoss R