linux-toradex.git/include/linux/thermal.h, branch v4.4.5

Thermal: do thermal zone update after a cooling device registered

2016-03-03T23:07:25+00:00

commit 4511f7166a2deb5f7a578cf87fd2fe1ae83527e3 upstream.

When a new cooling device is registered, we need to update the
thermal zone to set the new registered cooling device to a proper
state.

This fixes a problem that the system is cool, while the fan devices
are left running on full speed after boot, if fan device is registered
after thermal zone device.

Here is the history of why current patch looks like this:
https://patchwork.kernel.org/patch/7273041/

Reference:https://bugzilla.kernel.org/show_bug.cgi?id=92431
Tested-by: Manuel Krause 
Tested-by: szegad 
Tested-by: prash 
Tested-by: amish 
Reviewed-by: Javi Merino 
Signed-off-by: Zhang Rui 
Signed-off-by: Chen Yu 
Signed-off-by: Greg Kroah-Hartman

Thermal: initialize thermal zone device correctly

2016-03-03T23:07:25+00:00

commit bb431ba26c5cd0a17c941ca6c3a195a3a6d5d461 upstream.

After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().

Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.

Tested-by: Manuel Krause 
Tested-by: szegad 
Tested-by: prash 
Tested-by: amish 
Tested-by: Matthias 
Reviewed-by: Javi Merino 
Signed-off-by: Zhang Rui 
Signed-off-by: Chen Yu 
Signed-off-by: Greg Kroah-Hartman

thermal: fix thermal_zone_bind_cooling_device prototype

2015-11-23T23:34:34+00:00

When the prototype for thermal_zone_bind_cooling_device
changed, the static inline wrapper function was left alone,
which in theory can cause build warnings:

I have seen this error in the past:
drivers/thermal/db8500_thermal.c: In function 'db8500_cdev_bind':
drivers/thermal/db8500_thermal.c:78:9: error: too many arguments to function 'thermal_zone_bind_cooling_device'
   ret = thermal_zone_bind_cooling_device(thermal, i, cdev,

while this one no longer shows up, there is no doubt that
the prototype is still wrong, so let's just fix it anyway.

Signed-off-by: Arnd Bergmann 
Fixes: 6cd9e9f629f1 ("thermal: of: fix cooling device weights in device tree")
Signed-off-by: Eduardo Valentin

linux/thermal.h: rename KELVIN_TO_CELSIUS to DECI_KELVIN_TO_CELSIUS

2015-10-10T03:32:30+00:00

The macros KELVIN_TO_CELSIUS and CELSIUS_TO_KELVIN actually convert
between deciKelvins and Celsius, so rename them to reflect that. While
at it, use a statement expression in DECI_KELVIN_TO_CELSIUS to prevent
expanding the argument multiple times and get rid of a few casts.

Signed-off-by: Rasmus Villemoes 
Acked-by: Darren Hart 
Signed-off-by: Zhang Rui

thermal: Add a function to get the minimum power

2015-09-14T14:39:46+00:00

The thermal core already has a function to get the maximum power of a
cooling device: power_actor_get_max_power().  Add a function to get the
minimum power of a cooling device.

Cc: Zhang Rui 
Cc: Eduardo Valentin 
Reviewed-by: Daniel Kurtz 
Signed-off-by: Javi Merino 
Signed-off-by: Eduardo Valentin

thermal: Fix thermal_zone_of_sensor_register to match documentation

2015-09-14T02:33:07+00:00

thermal_zone_of_sensor_register is documented as returning a pointer
to either a valid thermal_zone_device on success, or a corresponding
ERR_PTR() value.

In contrast, the function returns NULL when THERMAL_OF is configured
off. Fix this.

Signed-off-by: Punit Agrawal 
Acked-by: Guenter Roeck 
Cc: Eduardo Valentin 
Cc: Zhang Rui 
Signed-off-by: Eduardo Valentin

thermal: consistently use int for temperatures

2015-08-03T15:15:50+00:00

The thermal code uses int, long and unsigned long for temperatures
in different places.

Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.

'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.

Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.

Signed-off-by: Sascha Hauer 
Acked-by: Geert Uytterhoeven 
Reviewed-by: Jean Delvare 
Reviewed-by: Lukasz Majewski 
Reviewed-by: Darren Hart 
Reviewed-by: Heiko Stuebner 
Reviewed-by: Peter Feuerer 
Cc: Punit Agrawal 
Cc: Zhang Rui 
Cc: Eduardo Valentin 
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare 
Cc: Peter Feuerer 
Cc: Heiko Stuebner 
Cc: Lukasz Majewski 
Cc: Stephen Warren 
Cc: Thierry Reding 
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck 
Cc: Rafael J. Wysocki 
Cc: Maxime Ripard 
Cc: Darren Hart 
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui

thermal: support slope and offset coefficients

2015-05-12T02:46:52+00:00

It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.

This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.

The constants are available through sysfs.

It is up to the device driver to determine
the usage of these values.

Signed-off-by: Eduardo Valentin

thermal: introduce the Power Allocator governor

2015-05-05T04:27:52+00:00

The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui 
Cc: Eduardo Valentin 
Signed-off-by: Punit Agrawal 
Signed-off-by: Javi Merino 
Signed-off-by: Eduardo Valentin

thermal: extend the cooling device API to include power information

2015-05-05T04:27:52+00:00

Add three optional callbacks to the cooling device interface to allow
them to express power.  In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.

Cc: Zhang Rui 
Cc: Eduardo Valentin 
Signed-off-by: Javi Merino 
Signed-off-by: Eduardo Valentin