summaryrefslogtreecommitdiff
path: root/Documentation/devicetree/bindings/vendor-prefixes.yaml
diff options
context:
space:
mode:
authorLinus Torvalds <torvalds@linux-foundation.org>2019-07-11 18:35:30 -0700
committerLinus Torvalds <torvalds@linux-foundation.org>2019-07-11 18:35:30 -0700
commitd06e4156430e7c5eb4f04dabcaa0d9e2fba335e3 (patch)
tree6a8e0663a501b321655dd12683a48635474c28f0 /Documentation/devicetree/bindings/vendor-prefixes.yaml
parent8931084c0d017314ad025f19353f7c5c1d3782d8 (diff)
parentf59d261180f3b66367962f1974090815ce710056 (diff)
Merge tag 'devicetree-for-5.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull Devicetree updates from Rob Herring: - DT binding schema examples are now validated against the schemas. Various examples are fixed due to that. - Sync dtc with upstream version v1.5.0-30-g702c1b6c0e73 - Initial schemas for networking bindings. This includes ethernet, phy and mdio common bindings with several Allwinner and stmmac converted to the schema. - Conversion of more Arm top-level SoC/board bindings to DT schema - Conversion of PSCI binding to DT schema - Rework Arm CPU schema to coexist with other CPU schemas - Add a bunch of missing vendor prefixes and new ones for SoChip, Sipeed, Kontron, B&R Industrial Automation GmbH, and Espressif - Add Mediatek UART RX wakeup support to binding - Add reset to ST UART binding - Remove some Linuxisms from the endianness common-properties.txt binding - Make the flattened DT read-only after init - Ignore disabled reserved memory nodes - Clean-up some dead code in FDT functions * tag 'devicetree-for-5.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (56 commits) dt-bindings: vendor-prefixes: add Sipeed dt-bindings: vendor-prefixes: add SoChip dt-bindings: 83xx-512x-pci: Drop cell-index property dt-bindings: serial: add documentation for Rx in-band wakeup support dt-bindings: arm: Convert RDA Micro board/soc bindings to json-schema of: unittest: simplify getting the adapter of a client of/fdt: pass early_init_dt_reserve_memory_arch() with bool type nomap of/platform: Drop superfluous cast in of_device_make_bus_id() dt-bindings: usb: ehci: Fix example warnings dt-bindings: net: Use phy-mode instead of phy-connection-type dt-bindings: simple-framebuffer: Add requirement for pipelines dt-bindings: display: Fix simple-framebuffer example dt-bindings: net: mdio: Add child nodes dt-bindings: net: mdio: Add address and size cells dt-bindings: net: mdio: Add a nodename pattern dt-bindings: mtd: sunxi-nand: Drop 'maxItems' from child 'reg' property dt-bindings: arm: Limit cpus schema to only check Arm 'cpu' nodes dt-bindings: backlight: lm3630a: correct schema validation dt-bindings: net: dwmac: Deprecate the PHY reset properties dt-bindings: net: sun8i-emac: Convert the binding to a schemas ...
Diffstat (limited to 'Documentation/devicetree/bindings/vendor-prefixes.yaml')
-rw-r--r--Documentation/devicetree/bindings/vendor-prefixes.yaml76
1 files changed, 72 insertions, 4 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml
index 1acf806b62bf..18b79c4cf7d5 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.yaml
+++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml
@@ -149,6 +149,8 @@ patternProperties:
description: Broadcom Corporation
"^buffalo,.*":
description: Buffalo, Inc.
+ "^bur,.*":
+ description: B&R Industrial Automation GmbH
"^bticino,.*":
description: Bticino International
"^calxeda,.*":
@@ -177,6 +179,8 @@ patternProperties:
description: Common Hardware Reference Platform
"^chunghwa,.*":
description: Chunghwa Picture Tubes Ltd.
+ "^chuwi,.*":
+ description: Chuwi Innovation Ltd.
"^ciaa,.*":
description: Computadora Industrial Abierta Argentina
"^cirrus,.*":
@@ -187,8 +191,12 @@ patternProperties:
description: Chips&Media, Inc.
"^cnxt,.*":
description: Conexant Systems, Inc.
+ "^colorfly,.*":
+ description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
"^compulab,.*":
description: CompuLab Ltd.
+ "^corpro,.*":
+ description: Chengdu Corpro Technology Co., Ltd.
"^cortina,.*":
description: Cortina Systems, Inc.
"^cosmic,.*":
@@ -201,6 +209,8 @@ patternProperties:
description: Crystalfontz America, Inc.
"^csky,.*":
description: Hangzhou C-SKY Microsystems Co., Ltd
+ "^csq,.*":
+ description: Shenzen Chuangsiqi Technology Co.,Ltd.
"^cubietech,.*":
description: Cubietech, Ltd.
"^cypress,.*":
@@ -221,6 +231,8 @@ patternProperties:
description: Devantech, Ltd.
"^dh,.*":
description: DH electronics GmbH
+ "^difrnce,.*":
+ description: Shenzhen Yagu Electronic Technology Co., Ltd.
"^digi,.*":
description: Digi International Inc.
"^digilent,.*":
@@ -243,6 +255,8 @@ patternProperties:
description: DPTechnics
"^dragino,.*":
description: Dragino Technology Co., Limited
+ "^dserve,.*":
+ description: dServe Technology B.V.
"^ea,.*":
description: Embedded Artists AB
"^ebs-systart,.*":
@@ -265,6 +279,8 @@ patternProperties:
description: Emlid, Ltd.
"^emmicro,.*":
description: EM Microelectronic
+ "^empire-electronix,.*":
+ description: Empire Electronix
"^emtrion,.*":
description: emtrion GmbH
"^endless,.*":
@@ -279,6 +295,8 @@ patternProperties:
description: Ecole Polytechnique Fédérale de Lausanne
"^epson,.*":
description: Seiko Epson Corp.
+ "^esp,.*":
+ description: Espressif Systems Co. Ltd.
"^est,.*":
description: ESTeem Wireless Modems
"^ettus,.*":
@@ -329,6 +347,8 @@ patternProperties:
description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
"^GEFanuc,.*":
description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
+ "^gemei,.*":
+ description: Gemei Digital Technology Co., Ltd.
"^geniatech,.*":
description: Geniatech, Inc.
"^giantec,.*":
@@ -375,10 +395,14 @@ patternProperties:
description: Honeywell
"^hp,.*":
description: Hewlett Packard
+ "^hsg,.*":
+ description: HannStar Display Co.
"^holtek,.*":
description: Holtek Semiconductor, Inc.
"^hwacom,.*":
description: HwaCom Systems Inc.
+ "^hyundai,.*":
+ description: Hyundai Technology
"^i2se,.*":
description: I2SE GmbH
"^ibm,.*":
@@ -393,6 +417,10 @@ patternProperties:
description: ILI Technology Corporation (ILITEK)
"^img,.*":
description: Imagination Technologies Ltd.
+ "^incircuit,.*":
+ description: In-Circuit GmbH
+ "^inet-tek,.*":
+ description: Shenzhen iNet Mobile Internet Technology Co., Ltd
"^infineon,.*":
description: Infineon Technologies
"^inforce,.*":
@@ -427,6 +455,8 @@ patternProperties:
description: Japan Display Inc.
"^jedec,.*":
description: JEDEC Solid State Technology Association
+ "^jesurun,.*":
+ description: Shenzhen Jesurun Electronics Business Dept.
"^jianda,.*":
description: Jiandangjing Technology Co., Ltd.
"^karo,.*":
@@ -451,6 +481,8 @@ patternProperties:
description: Rakuten Kobo Inc.
"^koe,.*":
description: Kaohsiung Opto-Electronics Inc.
+ "^kontron,.*":
+ description: Kontron S&T AG
"^kosagi,.*":
description: Sutajio Ko-Usagi PTE Ltd.
"^kyo,.*":
@@ -459,6 +491,8 @@ patternProperties:
description: LaCie
"^laird,.*":
description: Laird PLC
+ "^lamobo,.*":
+ description: Ketai Huajie Technology Co., Ltd.
"^lantiq,.*":
description: Lantiq Semiconductor
"^lattice,.*":
@@ -477,6 +511,8 @@ patternProperties:
description: Lichee Pi
"^linaro,.*":
description: Linaro Limited
+ "^linksprite,.*":
+ description: LinkSprite Technologies, Inc.
"^linksys,.*":
description: Belkin International, Inc. (Linksys)
"^linux,.*":
@@ -493,6 +529,8 @@ patternProperties:
description: Liebherr-Werk Nenzing GmbH
"^macnica,.*":
description: Macnica Americas
+ "^mapleboard,.*":
+ description: Mapleboard.org
"^marvell,.*":
description: Marvell Technology Group Ltd.
"^maxbotix,.*":
@@ -533,6 +571,8 @@ patternProperties:
description: Micron Technology Inc.
"^mikroe,.*":
description: MikroElektronika d.o.o.
+ "^miniand,.*":
+ description: Miniand Tech
"^minix,.*":
description: MINIX Technology Ltd.
"^miramems,.*":
@@ -663,24 +703,32 @@ patternProperties:
description: Picochip Ltd
"^pine64,.*":
description: Pine64
+ "^pineriver,.*":
+ description: Shenzhen PineRiver Designs Co., Ltd.
"^pixcir,.*":
description: PIXCIR MICROELECTRONICS Co., Ltd
"^plantower,.*":
description: Plantower Co., Ltd
"^plathome,.*":
- description: Plat'Home Co., Ltd.
+ description: Plat\'Home Co., Ltd.
"^plda,.*":
description: PLDA
"^plx,.*":
description: Broadcom Corporation (formerly PLX Technology)
"^pni,.*":
description: PNI Sensor Corporation
+ "^polaroid,.*":
+ description: Polaroid Corporation
"^portwell,.*":
description: Portwell Inc.
"^poslab,.*":
description: Poslab Technology Co., Ltd.
+ "^pov,.*":
+ description: Point of View International B.V.
"^powervr,.*":
description: PowerVR (deprecated, use img)
+ "^primux,.*":
+ description: Primux Trading, S.L.
"^probox2,.*":
description: PROBOX2 (by W2COMP Co., Ltd.)
"^pulsedlight,.*":
@@ -693,6 +741,8 @@ patternProperties:
description: QEMU, a generic and open source machine emulator and virtualizer
"^qi,.*":
description: Qi Hardware
+ "^qihua,.*":
+ description: Chengdu Kaixuan Information Technology Co., Ltd.
"^qiaodian,.*":
description: QiaoDian XianShi Corporation
"^qnap,.*":
@@ -715,6 +765,8 @@ patternProperties:
description: Realtek Semiconductor Corp.
"^renesas,.*":
description: Renesas Electronics Corporation
+ "^rervision,.*":
+ description: Shenzhen Rervision Technology Co., Ltd.
"^richtek,.*":
description: Richtek Technology Corporation
"^ricoh,.*":
@@ -783,8 +835,14 @@ patternProperties:
description: Silergy Corp.
"^siliconmitus,.*":
description: Silicon Mitus, Inc.
- "^simte,.*":
- description: k
+ "^simtek,.*":
+ description: Cypress Semiconductor Corporation (Simtek Corporation)
+ "^sinlinx,.*":
+ description: Sinlinx Electronics Technology Co., LTD
+ "^sinovoip,.*":
+ description: SinoVoip Co., Ltd
+ "^sipeed,.*":
+ description: Shenzhen Sipeed Technology Co., Ltd.
"^sirf,.*":
description: SiRF Technology, Inc.
"^sis,.*":
@@ -797,6 +855,8 @@ patternProperties:
description: Standard Microsystems Corporation
"^snps,.*":
description: Synopsys, Inc.
+ "^sochip,.*":
+ description: Shenzhen SoChip Technology Co., Ltd.
"^socionext,.*":
description: Socionext Inc.
"^solidrun,.*":
@@ -903,6 +963,8 @@ patternProperties:
description: United Radiant Technology Corporation
"^usi,.*":
description: Universal Scientific Industrial Co., Ltd.
+ "^utoo,.*":
+ description: Aigo Digital Technology Co., Ltd.
"^v3,.*":
description: V3 Semiconductor
"^vamrs,.*":
@@ -939,10 +1001,14 @@ patternProperties:
description: Winbond Electronics corp.
"^winstar,.*":
description: Winstar Display Corp.
+ "^wits,.*":
+ description: Shenzhen Merrii Technology Co., Ltd. (WITS)
"^wlf,.*":
description: Wolfson Microelectronics
"^wm,.*":
description: Wondermedia Technologies, Inc.
+ "^wobo,.*":
+ description: Wobo
"^x-powers,.*":
description: X-Powers
"^xes,.*":
@@ -953,6 +1019,8 @@ patternProperties:
description: Xilinx
"^xunlong,.*":
description: Shenzhen Xunlong Software CO.,Limited
+ "^yones-toptech,.*":
+ description: Yones Toptech Co., Ltd.
"^ysoft,.*":
description: Y Soft Corporation a.s.
"^zarlink,.*":
@@ -970,7 +1038,7 @@ patternProperties:
# Normal property name match without a comma
# These should catch all node/property names without a prefix
- "^[a-zA-Z0-9#][a-zA-Z0-9+\\-._@]{0,63}$": true
+ "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
"^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
"^#.*": true