diff options
| author | Javi Merino <javi.merino@arm.com> | 2015-02-18 16:04:24 +0000 |
|---|---|---|
| committer | Eduardo Valentin <edubezval@gmail.com> | 2015-05-04 21:27:51 -0700 |
| commit | db91651311c8b89978b17d27634582c28c33363e (patch) | |
| tree | 67786b4eb698a3f3712a83a87ad89a0c267c1627 /Documentation/thermal | |
| parent | 80b89172f9c3410764e0d962d6494c0af6d6dba8 (diff) | |
thermal: export weight to sysfs
It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed. Export them to sysfs.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Diffstat (limited to 'Documentation/thermal')
| -rw-r--r-- | Documentation/thermal/sysfs-api.txt | 15 |
1 files changed, 14 insertions, 1 deletions
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt index 7ec632ed9769..3625453ceef6 100644 --- a/Documentation/thermal/sysfs-api.txt +++ b/Documentation/thermal/sysfs-api.txt @@ -194,6 +194,8 @@ thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. /sys/class/thermal/thermal_zone[0-*]: |---cdev[0-*]: [0-*]th cooling device in current thermal zone |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with + |---cdev[0-*]_weight: Influence of the cooling device in + this thermal zone Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, the generic thermal driver also creates a hwmon sysfs I/F for each _type_ @@ -267,6 +269,14 @@ cdev[0-*]_trip_point point. RO, Optional +cdev[0-*]_weight + The influence of cdev[0-*] in this thermal zone. This value + is relative to the rest of cooling devices in the thermal + zone. For example, if a cooling device has a weight double + than that of other, it's twice as effective in cooling the + thermal zone. + RW, Optional + passive Attribute is only present for zones in which the passive cooling policy is not supported by native thermal driver. Default is zero @@ -320,7 +330,8 @@ passive, active. If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time, it may register itself as a thermal_zone_device (thermal_zone1) with 4 trip points in all. It has one processor and one fan, which are both registered as -thermal_cooling_device. +thermal_cooling_device. Both are considered to have the same +effectiveness in cooling the thermal zone. If the processor is listed in _PSL method, and the fan is listed in _AL0 method, the sys I/F structure will be built like this: @@ -342,8 +353,10 @@ method, the sys I/F structure will be built like this: |---trip_point_3_type: active1 |---cdev0: --->/sys/class/thermal/cooling_device0 |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ + |---cdev0_weight: 1024 |---cdev1: --->/sys/class/thermal/cooling_device3 |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ + |---cdev1_weight: 1024 |cooling_device0: |---type: Processor |