| Age | Commit message (Collapse) | Author |
|---|
|
See the thermal code, the obvious typo from my editor.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
The cooling-{min,max}-level properties are marked as optional in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt and the usage
in various device tree matches this, i.e., some cooling device in the
device trees provide these properties while others do not.
Make the bindings in
Documentation/devicetree/bindings/thermal/thermal.txt consistent with
the cpufreq-dt bindings by marking the cooling-*-level properties as
optional.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: Rob Herring <robh@kernel.org>
|
|
The device trees in the kernel as well as the binding description in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt use the
cooling-{min,max}-level property.
Fix the inconsistency with the binding description in
Documentation/devicetree/bindings/thermal/thermal.txt by changing
cooling-*-state properties to cooling-*-level.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: Rob Herring <robh@kernel.org>
|
|
Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.
If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
There are various issues with the examples in this documentation, some
of the DT labels are invalid and one of the macro THERMAL_NO_LIMITS
referenced is not available as well.
This patch attempts to fix such errors in the documentation.
Signed-off-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.
This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.
This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.
Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
