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Add dts binding doc for i.MX8MM TMU.
Signed-off-by: Bai Ping <ping.bai@nxp.com>
Reviewed-by: Anson Huang <Anson.Huang@nxp.com>
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Add i.MX8QM/QXP temp sensor binding doc.
Signed-off-by: Bai Ping <ping.bai@nxp.com>
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'thermal-tegra-hw-throttle' into next
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Add HW throttle configuration sub-node for soctherm, which
is used to describe the throttle event, and worked as a
cooling device. The "hot" type trip in thermal zone can
be bound to this cooling device, and trigger the throttle
function.
Signed-off-by: Wei Ni <wni@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: Dawei Chien <dawei.chien@mediatek.com>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Maxim Semiconductor MAX77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add DT binding document to details out the DT property related
to MAX77620 thermal functionality.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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See the thermal code, the obvious typo from my editor.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
- Introduce generic ADC thermal driver, based on OF thermal (Laxman
Dewangan)
- Introduce new thermal driver for Tango chips (Marc Gonzalez)
- Rockchip driver support for RK3399, RK3366, and some fixes (Caesar
Wang, Elaine Zhang and Shawn Lin)
- Add CPU power cooling model to Mediatek thermal driver (Dawei Chien)
- Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin)
- TI thermal driver gained a new maintainer (Keerthy).
- Enabled powerclamp driver by checking CPU feature and package cstate
counter instead of CPU whitelist (Jacob Pan)
- Various fixes on thermal governor, OF thermal, Tegra, and RCAR
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits)
thermal: tango: initialize TEMPSI_CFG
thermal: rockchip: use the usleep_range instead of udelay
thermal: rockchip: add the notes for better reading
thermal: rockchip: Support RK3366 SoCs in the thermal driver
thermal: rockchip: handle the power sequence for tsadc controller
thermal: rockchip: update the tsadc table for rk3399
thermal: rockchip: fixes the code_to_temp for tsadc driver
thermal: rockchip: disable thermal->clk in err case
thermal: tegra: add Tegra132 specific SOC_THERM driver
thermal: fix ptr_ret.cocci warnings
thermal: mediatek: Add cpu dynamic power cooling model.
thermal: generic-adc: Add ADC based thermal sensor driver
thermal: generic-adc: Add DT binding for ADC based thermal sensor
thermal: tegra: fix static checker warning
thermal: tegra: mark PM functions __maybe_unused
thermal: add temperature sensor support for tango SoC
thermal: hisilicon: fix IRQ imbalance enabling
thermal: hisilicon: support to use any sensor
thermal: rcar: Remove binding docs for r8a7794
thermal: tegra: add PM support
...
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Sometimes, thermal sensors like NCT thermistors are connected to
the ADC channel. The temperature is read by reading the voltage
across the sensor resistance via ADC and referring the lookup
table for ADC value to temperature.
Add DT binding doc for the ADC based thermal sensor driver to
detail the DT property and provide the example for how to use it.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Acked-by: Rob Herring <rob@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.
This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The latest information that I have is that there is no thermal IP
block present on the r8a7794 SoC so remove the corresponding binding.
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The "critical" type trip in thermal zone can be
set to SOC_THERM hardware, it can trigger shut down
or reset event from hardware.
Signed-off-by: Wei Ni <wni@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Device tree binding for NVIDIA Tegra have traditionally carried the
"nvidia," vendor prefix in the filename. A couple of odd ones don't, so
fix them up for consistency.
Also rename existing bindings to reflect the first compatible value that
they document. This wasn't done consistently either.
Acked-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rob Herring <robh@kernel.org>
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When Tegra124 support was first merged the unit-addresses of all devices
were listed with a "0," prefix to encode the reg property's second cell.
It turns out that this notation is not correct, and the "," separator is
only used to separate fields in the unit address (such as the device and
function number in PCI devices), not individual cells for addresses
with more than one cell.
Acked-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rob Herring <robh@kernel.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
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The Exynos Thermal Management Unit binding says that the vtmu-supply
is optional but is listed in the required properties section. Add an
optional properties section and move the regulator property there.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Andi Shyti <andi.shyti@samsung.com>
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Document the number of configurable temperature thresholds (for
trip-points in interrupt-driven mode).
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Commit 488c7455d74c ("thermal: exynos: Add the support for Exynos5433
TMU") added new compatible but forgot to update documentation.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT8173 and other SoCs.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch enables to use thermal-zone on DT if it was calles as
"renesas,rcar-thermal-gen2".
Previous style (= non thermal-zone) is still supported by
"renesas,rcar-thermal" to keep compatibility for "git bisect".
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
"The top merge commit was re-generated yesterday because two topic
branches were dropped from this pull request in the last minute due to
some unaddressed comments. All the other material has been in
linux-next for quite a while.
Specifics:
- Enhance thermal core to handle unexpected device cooling states
after fresh boot and system resume. From Zhang Rui and Chen Yu.
- Several fixes and cleanups on Rockchip and RCAR thermal drivers.
From Caesar Wang and Kuninori Morimoto.
- Add Broxton support for Intel processor thermal reporting device
driver. From Amy Wiles"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal: trip_point_temp_store() calls thermal_zone_device_update()
thermal: rcar: rcar_thermal_get_temp() return error if strange temp
thermal: rcar: check irq possibility in rcar_thermal_irq_xxx()
thermal: rcar: check every rcar_thermal_update_temp() return value
thermal: rcar: move rcar_thermal_dt_ids to upside
thermal: rockchip: Support the RK3399 SoCs in thermal driver
thermal: rockchip: Support the RK3228 SoCs in thermal driver
dt-bindings: rockchip-thermal: Support the RK3228/RK3399 SoCs compatible
thermal: rockchip: fix a trivial typo
Thermal: Enable Broxton SoC thermal reporting device
thermal: constify pch_dev_ops structure
Thermal: do thermal zone update after a cooling device registered
Thermal: handle thermal zone device properly during system sleep
Thermal: initialize thermal zone device correctly
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git://git.kernel.org/pub/scm/linux/kernel/git/powerpc/linux
Pull powerpc updates from Michael Ellerman:
"Core:
- Ground work for the new Power9 MMU from Aneesh Kumar K.V
- Optimise FP/VMX/VSX context switching from Anton Blanchard
Misc:
- Various cleanups from Krzysztof Kozlowski, John Ogness, Rashmica
Gupta, Russell Currey, Gavin Shan, Daniel Axtens, Michael Neuling,
Andrew Donnellan
- Allow wrapper to work on non-english system from Laurent Vivier
- Add rN aliases to the pt_regs_offset table from Rashmica Gupta
- Fix module autoload for rackmeter & axonram drivers from Luis de
Bethencourt
- Include KVM guest test in all interrupt vectors from Paul Mackerras
- Fix DSCR inheritance over fork() from Anton Blanchard
- Make value-returning atomics & {cmp}xchg* & their atomic_ versions
fully ordered from Boqun Feng
- Print MSR TM bits in oops messages from Michael Neuling
- Add TM signal return & invalid stack selftests from Michael Neuling
- Limit EPOW reset event warnings from Vipin K Parashar
- Remove the Cell QPACE code from Rashmica Gupta
- Append linux_banner to exception information in xmon from Rashmica
Gupta
- Add selftest to check if VSRs are corrupted from Rashmica Gupta
- Remove broken GregorianDay() from Daniel Axtens
- Import Anton's context_switch2 benchmark into selftests from
Michael Ellerman
- Add selftest script to test HMI functionality from Daniel Axtens
- Remove obsolete OPAL v2 support from Stewart Smith
- Make enter_rtas() private from Michael Ellerman
- PPR exception cleanups from Michael Ellerman
- Add page soft dirty tracking from Laurent Dufour
- Add support for Nvlink NPUs from Alistair Popple
- Add support for kexec on 476fpe from Alistair Popple
- Enable kernel CPU dlpar from sysfs from Nathan Fontenot
- Copy only required pieces of the mm_context_t to the paca from
Michael Neuling
- Add a kmsg_dumper that flushes OPAL console output on panic from
Russell Currey
- Implement save_stack_trace_regs() to enable kprobe stack tracing
from Steven Rostedt
- Add HWCAP bits for Power9 from Michael Ellerman
- Fix _PAGE_PTE breaking swapoff from Aneesh Kumar K.V
- Fix _PAGE_SWP_SOFT_DIRTY breaking swapoff from Hugh Dickins
- scripts/recordmcount.pl: support data in text section on powerpc
from Ulrich Weigand
- Handle R_PPC64_ENTRY relocations in modules from Ulrich Weigand
cxl:
- cxl: Fix possible idr warning when contexts are released from
Vaibhav Jain
- cxl: use correct operator when writing pcie config space values
from Andrew Donnellan
- cxl: Fix DSI misses when the context owning task exits from Vaibhav
Jain
- cxl: fix build for GCC 4.6.x from Brian Norris
- cxl: use -Werror only with CONFIG_PPC_WERROR from Brian Norris
- cxl: Enable PCI device ID for future IBM CXL adapter from Uma
Krishnan
Freescale:
- Freescale updates from Scott: Highlights include moving QE code out
of arch/powerpc (to be shared with arm), device tree updates, and
minor fixes"
* tag 'powerpc-4.5-1' of git://git.kernel.org/pub/scm/linux/kernel/git/powerpc/linux: (149 commits)
powerpc/module: Handle R_PPC64_ENTRY relocations
scripts/recordmcount.pl: support data in text section on powerpc
powerpc/powernv: Fix OPAL_CONSOLE_FLUSH prototype and usages
powerpc/mm: fix _PAGE_SWP_SOFT_DIRTY breaking swapoff
powerpc/mm: Fix _PAGE_PTE breaking swapoff
cxl: Enable PCI device ID for future IBM CXL adapter
cxl: use -Werror only with CONFIG_PPC_WERROR
cxl: fix build for GCC 4.6.x
powerpc: Add HWCAP bits for Power9
powerpc/powernv: Reserve PE#0 on NPU
powerpc/powernv: Change NPU PE# assignment
powerpc/powernv: Fix update of NVLink DMA mask
powerpc/powernv: Remove misleading comment in pci.c
powerpc: Implement save_stack_trace_regs() to enable kprobe stack tracing
powerpc: Fix build break due to paca mm_context_t changes
cxl: Fix DSI misses when the context owning task exits
MAINTAINERS: Update Scott Wood's e-mail address
powerpc/powernv: Fix minor off-by-one error in opal_mce_check_early_recovery()
powerpc: Fix style of self-test config prompts
powerpc/powernv: Only delay opal_rtc_read() retry when necessary
...
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This patchset attempts to new compatible for thermal founding
on RK3228/RK3399 SoCs.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add bindings documentation for TMU (Thermal Monitoring Unit) on QorIQ
platform.
Signed-off-by: Jia Hongtao <hongtao.jia@freescale.com>
Reviewed-by: Scott Wood <scottwood@freescale.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Scott Wood <scottwood@freescale.com>
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This patchset attempts to new compatible for thermal founding
on RK3368 SoCs.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The "init" pinctrl is defined we'll set
pinctrl to this state before probe and then "default" after probe.
Add the "init" and "sleep" pinctrl as the OTP gpio state, since we need
switch the pin to gpio state before the TSADC controller is reset.
AFAIK, the TSADC controller is reset, the tshut polarity will be
a *low* signal in a short period of time for some devices.
Says:
The TSADC get the temperature on rockchip thermal.
If T(current temperature) < (setting temperature), the OTP output the
*high* signal.
If T(current temperature) > (setting temperature), the OTP output the
*low* Signal.
In some cases, the OTP pin is connected to the PMIC, maybe the
PMIC can accept the reset response time to avoid this issue.
In other words, the system will be always reboot if we make the
OTP pin is connected the others IC to control the power.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add OMAP36xx support to ti-soc-thermal driver. This
chip is also unreliable. The data provided here is
based on OMAP36xx TRM:
http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdf
Signed-off-by: Eduardo Valentin <edubezva@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The cooling-{min,max}-level properties are marked as optional in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt and the usage
in various device tree matches this, i.e., some cooling device in the
device trees provide these properties while others do not.
Make the bindings in
Documentation/devicetree/bindings/thermal/thermal.txt consistent with
the cpufreq-dt bindings by marking the cooling-*-level properties as
optional.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: Rob Herring <robh@kernel.org>
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The device trees in the kernel as well as the binding description in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt use the
cooling-{min,max}-level property.
Fix the inconsistency with the binding description in
Documentation/devicetree/bindings/thermal/thermal.txt by changing
cooling-*-state properties to cooling-*-level.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: Rob Herring <robh@kernel.org>
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This adds documentation of device tree bindings for the
thermal sensor controller of hi6220 SoC.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.
If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.
Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.
Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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r8a73a4 is R-Mobile APE6, not AP6.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
Pull more thermal managament updates from Zhang Rui:
"Specifics:
- Exynos thermal driver refactoring. Several cleanups, code
optimization, unused symbols removal, and unused feature removal in
Exynos thermal driver. Thanks Lukasz for this effort.
- Exynos thermal driver support to OF thermal. After the code
refactoring, the driver earned the support to OF thermal. Chip
thermal data were moved from driver code to DTS, reducing the code
footprint. Thanks Lukasz for this.
- After receiving the OF thermal support, the exynos thermal driver
now must allow modular build. Thanks Arnd for detecting, reporting
and fixing this.
- Exynos thermal driver support to Exynos 7 SoC. Thanks Abhilash for
this.
- Accurate temperature reporting on Rockchip thermal driver, thanks
to Caesar.
- Fix on how OF thermal enables its zones, thanks Lukasz for fixing.
- Fixes in OF thermal examples under Documentation/. Thanks Srinivas
for fixing"
* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
thermal: exynos: Add TMU support for Exynos7 SoC
dts: Documentation: Add documentation for Exynos7 SoC thermal bindings
cpufreq: exynos: allow modular build
thermal: Fix examples in DT documentation
thermal: exynos: Correct sanity check at exynos_report_trigger() function
thermal: Kconfig: Remove config for not used EXYNOS_THERMAL_CORE
thermal: exynos: Remove exynos_tmu_data.c file
thermal: rockchip: make temperature reporting much more accurate
thermal: exynos: Remove exynos_thermal_common.[c|h] files
thermal: samsung: core: Exynos TMU rework to use device tree for configuration
dts: Documentation: Update exynos-thermal.txt example for Exynos5440
dts: Documentation: Extending documentation entry for exynos-thermal
cpufreq: exynos: Use device tree to determine if cpufreq cooling should be registered
thermal: exynos: Modify exynos thermal code to use device tree for cpu cooling configuration
thermal: exynos: Provide thermal_exynos.h file to be included in device tree files
thermal: exynos: cosmetic: Correct comment format
thermal: of: Enable thermal_zoneX when sensor is correctly added
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Align compatible strings for several IP blocks present on Tegra chips
with the latest doctrine from the DT maintainers:
http://marc.info/?l=devicetree&m=142255654213019&w=2
The primary objective here is to avoid checkpatch warnings, per:
http://marc.info/?l=linux-tegra&m=142201349727836&w=2
DT binding text files have been updated for the following IP blocks:
- PCIe
- SOR
- SoC timers
- AHB "gizmo"
- APB_MISC
- pinmux control
- UART
- PWM
- I2C
- SPI
- RTC
- PMC
- eFuse
- AHCI
- HDA
- XUSB_PADCTRL
- SDHCI
- SOC_THERM
- AHUB
- I2S
- EHCI
- USB PHY
N.B. The nvidia,tegra20-timer compatible string is removed from the
nvidia,tegra30-timer.txt documentation file because it's already
mentioned in the nvidia,tegra20-timer.txt documentation file.
This second version takes into account the following requests from
Rob Herring <robherring2@gmail.com>:
- Per-IP block patches have been combined into a single patch
- Explicit documentation about which compatible strings are actually
matched by the driver has been removed. In its place is implicit
documentation that loosely follows Rob's prescribed format:
"Must contain '"nvidia,<chip>-pcie", "nvidia,tegra20-pcie"' where
<chip> is tegra30, tegra132, ..." [...] "You should attempt to
document known values of <chip> if you use it"
Signed-off-by: Paul Walmsley <paul@pwsan.com>
Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: Dylan Reid <dgreid@chromium.org>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Hans de Goede <hdegoede@redhat.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Jingchang Lu <jingchang.lu@freescale.com>
Cc: John Crispin <blogic@openwrt.org>
Cc: Kumar Gala <galak@codeaurora.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Mikko Perttunen <mperttunen@nvidia.com>
Cc: Murali Karicheri <m-karicheri2@ti.com>
Cc: Paul Walmsley <pwalmsley@nvidia.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Peter De Schrijver <pdeschrijver@nvidia.com>
Cc: Peter Hurley <peter@hurleysoftware.com>
Cc: Sean Paul <seanpaul@chromium.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Takashi Iwai <tiwai@suse.de>
Cc: Tejun Heo <tj@kernel.org>
Cc: "Terje Bergström" <tbergstrom@nvidia.com>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Tuomas Tynkkynen <ttynkkynen@nvidia.com>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: dri-devel@lists.freedesktop.org
Cc: linux-i2c@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pci@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-pwm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Rob Herring <robh@kernel.org>
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Add documentation for exynos7 thermal bindings including compatible
name and special clock properties.
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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There are various issues with the examples in this documentation, some
of the DT labels are invalid and one of the macro THERMAL_NO_LIMITS
referenced is not available as well.
This patch attempts to fix such errors in the documentation.
Signed-off-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Updating exynos-thermal.txt documentation entry for Exynos5440
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Properties necessary for providing Exynos thermal configuration via device
tree.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The Armada 375 Z1 SoC revision is no longer supported. This commit
removes the quirk needed for the thermal sensor.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This add the necessary binding documentation for the thermal
found on Rockchip SoCs
Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This adds binding documentation and headers for the Tegra124
SOCTHERM device tree node.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Stephen Warren <swarren@nvidia.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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- r8a7792 (R-Car V2H)
- r8a7793 (R-Car M2-N)
- r8a7794 (R-Car E2)
r8a7791 is now called "R-Car M2-W".
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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i.MX6SX has some new features of thermal interrupt function,
there are LOW, HIGH and PANIC irq for thermal sensor, so add
platform data to separate different thermal version;
The reset value of LOW ALARM is 0 which means the highest
temp, so the LOW ALARM will be triggered once irq is enabled,
so we need to correct it before enabling thermal irq;
Enable PANIC ALARM as critical trip point, it will trigger
system reset via SRC module once PANIC IRQ is triggered, it
is pure hardware function, so use it instead of software
reset by cooling device.
Signed-off-by: Anson Huang <b20788@freescale.com>
Tested-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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and 'sti-thermal' of .git into next
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The documentation only mentioned the generic fallback compatible property.
Add the missing SoC-specific compatible properties, some of which are
already in use.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch add registers, bit fields and compatible strings for Exynos3250 TMU
(Thermal Management Unit). Exynos3250 uses the Cortex-A7 dual cores and has
a target speed of 1.0 GHz.
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
[Add MUX address setting bits by Jonghwa Lee]
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Reviewed-by: Amit Daniel Kachhap<amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Acked-by: Peter Griffin <peter.griffin@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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