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Update the binding info for i.MX8MP TMU module.
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Reviewed-by: Anson Huang <Anson.Huang@nxp.com>
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Add thermal binding doc for Freescale's i.MX8MM Thermal Monitoring Unit.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
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Some platforms like i.MX8M series SoCs have clock control for TMU,
add optional clocks property to the binding doc.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add a new compatible for thermal founding on PX30 SoCs.
Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Update binding description making lookup-table optional.
Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add thermal binding documentation for Amazon's Annapurna Labs Thermal
Sensor.
Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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qcs404 uses v1 of the TSENS IP block. Create a fallback DT property
"qcom,tsens-v1" to gather common code
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add OC HW throttle configuration for soctherm in DT.
It is used to describe the OCx throttle events.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add "nvidia,gpu-throt-level" property to set gpu hw
throttle level.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add optional property "nvidia,thermtrips".
If present, these trips will be used as HW shutdown trips,
and critical trips will be used as SW shutdown trips.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch adds binding document for mt8183 thermal controller.
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add binding document for supported thermal implementation
in Stingray.
Reviewed-by: Ray Jui <ray.jui@broadcom.com>
Reviewed-by: Scott Branden <scott.branden@broadcom.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com>
Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Document the R-Car E3 (R8A77990) SoC bindings.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Document RZ/G2E SoC (a.k.a. r8a774c0) bindings.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The thermal controller implementation on Tegra194 is very similar to the
implementation on Tegra186. Add a compatible string for the new
generation.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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RZ/G2M also has 3 interrupts routed to the TSC, but the list was not
updated to reflect this.
Just drop the list, as this is the case for this TSC variant in all
R-Car Gen3 and RZ/G2 SoCs.
Fixes: be6af481f3b2d508 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a774a1 support")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
Pull thermal SoC updates from Eduardo Valentin:
"Several new things coming up. Specifics:
- Rework of tsens and hisi thermal drivers
- OF-thermal now allows sharing multiple cooling devices on maps
- Added support for r8a7744 and R8A77970 on rcar thermal driver
- Added support for r8a774a1 on rcar_gen3 thermal driver
- New thermal driver stm32
- Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada,
qcom-spmi, rcar, da9062/61"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits)
thermal: da9062/61: Prevent hardware access during system suspend
thermal: rcar_thermal: Prevent doing work after unbind
thermal: rcar_thermal: Prevent hardware access during system suspend
thermal: rcar_gen3_thermal: add R8A77980 support
dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings
thermal: add stm32 thermal driver
dt-bindings: stm32-thermal: add binding documentation
thermal: rcar_thermal: add R8A77970 support
dt-bindings: thermal: rcar-thermal: document R8A77970 bindings
thermal: rcar_thermal: fix duplicate IRQ request
dt-bindings: thermal: rcar: Add device tree support for r8a7744
thermal/drivers/hisi: Add the dual clusters sensors for hi3660
thermal/drivers/hisi: Add more sensors channel
thermal/drivers/hisi: Remove pointless irq field
thermal/drivers/hisi: Use platform_get_irq_byname
thermal/drivers/hisi: Replace macro name with relevant sensor location
thermal/drivers/hisi: Add multiple sensors support
thermal/drivers/hisi: Prepare to support multiple sensors
thermal/drivers/hisi: Factor out the probe functions
thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer
...
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Document the R-Car V3H (R8A77980) SoC in the Renesas R-Car gen3 thermal
bindings.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add thermal binding documentation for STM32 DTS sensor
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Document the R-Car V3M (R8A77970) SoC in the Renesas R-Car gen2 thermal
bindings. The hardware is the same as in the R-Car D3 (R8A77995) plus an
extra status register.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add thermal sensor support for r8a7744 SoC. The Renesas RZ/G1N
(r8a7744) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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c(1) + x(1) was actually meant to be c(1) * x(1).
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add i.mx8mq specific compatible string.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Document RZ/G2M (R8A774A1) SoC bindings.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The current example for a thermal zone isn't very useful as reference
since it would result in a hardware shutdown at 145°C, instead of
allowing the system to try to shutdown gracefully. Without an ADC
channel a maximum of two trip points is useful in practice for this
sensor, with temperatures corresponding to the stage 1 and stage 2
'hardware trip points'. A critical trip point at stage 2 may allow the
system to shutdown before a hardware shutdown at stage 3 kicks in. It
should be noted though that by default the chip performs a 'partial
shutdown' when the temperature reaches stage 2, which may prevent an
orderly shutdown. The 'partial shutdown' can be disabled by software.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The documentation claims that the 'reg' property consists of two values,
the SPMI address and the length of the controller's registers. However
the SPMI bus to which it is added specifies "#size-cells = <0>;". Remove
the controller register length from the documentation of the field and the
example.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
- Add Daniel Lezcano as the reviewer of thermal framework and SoC
driver changes (Daniel Lezcano).
- Fix a bug in intel_dts_soc_thermal driver, which does not translate
IO-APIC GSI (Global System Interrupt) into Linux irq number (Hans de
Goede).
- For device tree bindings, allow cooling devices sharing same trip
point with same contribution value to share cooling map (Viresh
Kumar).
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
dt-bindings: thermal: Allow multiple devices to share cooling map
MAINTAINERS: Add Daniel Lezcano as designated reviewer for thermal
Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq number
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
Pull thermal management updates from Eduardo Valentin:
- rework tsens driver to add support for tsens-v2 (Amit Kucheria)
- rework armada thermal driver to use syscon and multichannel support
(Miquel Raynal)
- fixes to TI SoC, IMX, Exynos, RCar, and hwmon drivers
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (34 commits)
thermal: armada: fix copy-paste error in armada_thermal_probe()
thermal: rcar_thermal: avoid NULL dereference in absence of IRQ resources
thermal: samsung: Remove Exynos5440 clock handling left-overs
thermal: tsens: Fix negative temperature reporting
thermal: tsens: switch from of_iomap() to devm_ioremap_resource()
thermal: tsens: Rename variable
thermal: tsens: Add generic support for TSENS v2 IP
thermal: tsens: Rename tsens-8996 to tsens-v2 for reuse
thermal: tsens: Add support to split up register address space into two
dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IP
thermal: tsens: Get rid of unused fields in structure
thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info
thermal_hwmon: Sanitize attribute name passed to hwmon
dt-bindings: thermal: armada: add reference to new bindings
dt-bindings: cp110: add the thermal node in the syscon file
dt-bindings: cp110: update documentation since DT de-duplication
dt-bindings: ap806: add the thermal node in the syscon file
dt-bindings: cp110: prepare the syscon file to list other syscons nodes
dt-bindings: ap806: prepare the syscon file to list other syscons nodes
dt-bindings: cp110: rename cp110 syscon file
...
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Allow cooling devices sharing same trip point with same contribution
value to share the cooling map as well. Otherwise the same information
will be duplicated for each device sharing the trip point.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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We want to create common code for v2 of the TSENS IP block that is used in
a large number of Qualcomm SoCs. "qcom,tsens-v2" should be able to handle
most of the common functionality start with a common get_temp() function.
It is also necessary to split out the memory regions for the TM and SROT
register banks because their offsets are not constant across SoC families.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Tested-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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New bindings (using a syscon) are available for AP806 and CP110
compatibles. Add a reference to these files from the original
documentation.
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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'interrupt-parent' is often documented as part of define bindings, but
it is really outside the scope of a device binding. It's never required
in a given node as it is often inherited from a parent node. Or it can
be implicit if a parent node is an 'interrupt-controller' node. So
remove it from all the binding files.
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
Pull thermal SoC updates from Zhang Rui:
"Thermal SoC management updates:
- imx thermal driver now supports i.MX7 thermal sensor (Anson Huang)
- exynos thermal driver dropped support for exynos 5440 (Krzysztof
Kozlowski)
- rcar_thermal now supports r8a77995 (Yoshihiro Kaneko)
- rcar_gen3_thermal now supports r8a77965 (Niklas Söderlund)
- qcom-spmi-temp-alarm now supports GEN2 PMIC peripherals (David
Collins)
- uniphier thermal now supports UniPhier PXs3 (Kunihiko Hayashi)
- mediatek thermal now supports MT7622 SoC (Sean Wang)
- considerable refactoring of exynos driver (Bartlomiej
Zolnierkiewicz)
- small fixes all over the place on different drivers"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (50 commits)
thermal: qcom: tsens: Allow number of sensors to come from DT
thermal: tegra: soctherm: add const to struct thermal_cooling_device_ops
thermal: exynos: Reduce severity of too early temperature read
thermal: imx: Switch to SPDX identifier
thermal: qcom-spmi-temp-alarm: add support for GEN2 PMIC peripherals
thermal: ti-soc-thermal: fix incorrect entry in omap5430_adc_to_temp[]
thermal: rcar_thermal: add r8a77995 support
dt-bindings: thermal: rcar-thermal: add R8A77995 support
thermal: mediatek: use of_device_get_match_data()
thermal: exynos: remove trip reporting to user-space
thermal: exynos: remove unused defines for Exynos5433
thermal: exynos: cleanup code for enabling threshold interrupts
thermal: exynos: check return values of ->get_trip_[temp, hyst] methods
thermal: exynos: move trips setting to exynos_tmu_initialize()
thermal: exynos: set trips in ascending order in exynos7_tmu_initialize()
thermal: exynos: do not use trips structure directly in ->tmu_initialize
thermal: exynos: add exynos*_tmu_set_[trip,hyst]() helpers
thermal: exynos: move IRQs clearing to exynos_tmu_initialize()
thermal: exynos: clear IRQs later in exynos4412_tmu_initialize()
thermal: exynos: make ->tmu_initialize method void
...
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull DeviceTree updates from Rob Herring:
- Sync dtc with upstream version v1.4.6-21-g84e414b0b5bc. This adds new
warnings which are either fixed or disabled by default (enabled with
W=1).
- Validate an untrusted offset in DT overlay function
update_usages_of_a_phandle_reference
- Fix a use after free error of_platform_device_destroy
- Fix an off by 1 string errors in unittest
- Avoid creating a struct device for OPP nodes
- Update DT specific submitting-patches.txt with patch content and
subject requirements.
- Move some bindings to their proper subsystem locations
- Add vendor prefixes for Kaohsiung, SiFive, Avnet, Wi2Wi, Logic PD,
and ArcherMind
- Add documentation for "no-gpio-delays" property in FSI bus GPIO
master
- Add compatible for r8a77990 SoC ravb ethernet block
- More wack-a-mole removal of 'status' property in examples
* tag 'devicetree-for-4.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (25 commits)
dt-bindings: submitting-patches: add guidance on patch content and subject
of: platform: stop accessing invalid dev in of_platform_device_destroy
dt-bindings: net: ravb: Add support for r8a77990 SoC
dt-bindings: Add vendor prefix for ArcherMind
dt-bindings: fsi-master-gpio: Document "no-gpio-delays" property
dt-bindings: Add vendor prefix for Logic PD
of: overlay: validate offset from property fixups
of: unittest: for strings, account for trailing \0 in property length field
drm: rcar-du: disable dtc graph-endpoint warnings on DT overlays
kbuild: disable new dtc graph and unit-address warnings
scripts/dtc: Update to upstream version v1.4.6-21-g84e414b0b5bc
MAINTAINERS: add keyword for devicetree overlay notifiers
dt-bindings: define vendor prefix for Wi2Wi, Inc.
dt-bindings: Add vendor prefix for Avnet, Inc.
dt-bindings: Relocate Tegra20 memory controller bindings
dt-bindings: Add "sifive" vendor prefix
dt-bindings: exynos: move ADC binding to iio/adc/ directory
dt-bindings: powerpc/4xx: move 4xx NDFC and EMAC bindings to subsystem directories
dt-bindings: move various RNG bindings to rng/ directory
dt-bindings: move various timer bindings to timer/ directory
...
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For platforms that has multiple copies of the TSENS hardware block it's
necessary to be able to specify the number of sensors per block in DeviceTree.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Update rcar thermal dt-binding to add R8A77995 info.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The Exynos5440 is not actively developed, there are no development
boards available and probably there are no real products with it.
Remove wide-tree support for Exynos5440.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
[b.zolnierkie: ported over driver changes]
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Based on previous work by Ryo Kataoka <ryo.kataoka.wt@renesas.com>.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add a compatible string for thermal monitor implemented on
UniPhier PXs3 SoC.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch adds i.MX7 thermal sensor support, most
of the i.MX7 thermal sensor functions are same with
i.MX6 except the registers offset/layout, so we move
those registers offset/layout definitions to soc data
structure.
i.MX7 uses single calibration data @25C, the calibration
data is located at OCOTP offset 0x4F0, bit[17:9], the
formula is as below:
Tmeas = (Nmeas - n1) + 25; n1 is the fuse value for 25C.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Bai Ping <ping.bai@nxp.com>
Acked-by: Dong Aisheng <aisheng.dong@nxp.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add devicetree bindings for MediaTek MT7622 thermal controller
Changes v1 -> v2: add tag from Rob
Signed-off-by: Sean Wang <sean.wang@mediatek.com>
Signed-off-by: Shunli Wang <shunli.wang@mediatek.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The datasheet has been expanded with more registers and the DT files
have been updated with the new size. This change updates the example so
writing new DT files can use the enhanced driver which uses the new
registers.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
[robh: s/have/has/, s/enchanted/enhanced/]
Signed-off-by: Rob Herring <robh@kernel.org>
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The "cooling-min-level" and "cooling-max-level" properties are not
parsed by any part of kernel currently and the max cooling state of a
CPU cooling device is found by referring to the cpufreq table instead.
Remove the unused bindings.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Remove documentation for longer needed samsung thermal properties.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Due to the old method has already been marked as deprecated in binding
doc, so obviously it's better to update the example to new bindings
as well.
Cc: Shawn Guo <shawn.guo@linaro.org>
Cc: Leonard Crestez <leonard.crestez@nxp.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
- fix a race condition issue in power allocator governor (Yi Zeng).
- add support for AP806 and CP110 in armada thermal driver, together
with several improvements (Baruch Siach, Miquel Raynal)
- add support for r8z7743 in rcar thermal driver (Biju Das)
- convert thermal core to use new hwmon API to avoid warning (Fabio
Estevam)
- small fixes and cleanups in thermal core and x86_pkg_thermal,
int3400_thermal, hisi_thermal, mtk_thermal and imx_thermal drivers
(Pravin Shedge, Geert Uytterhoeven, Alexey Khoroshilov, Brian Bian,
Matthias Brugger, Nicolin Chen, Uwe Kleine-König)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
thermal: thermal_hwmon: Convert to hwmon_device_register_with_info()
thermal/x86 pkg temp: Remove debugfs_create_u32() casts
thermal: int3400_thermal: fix error handling in int3400_thermal_probe()
thermal/drivers/hisi: Remove bogus const from function return type
thermal: armada: Give meaningful names to the thermal zones
thermal: armada: Wait sensors validity before exiting the init callback
thermal: armada: Change sensors trim default value
thermal: armada: Update Kconfig and module description
thermal: armada: Add support for Armada CP110
thermal: armada: Add support for Armada AP806
thermal: armada: Use real status register name
thermal: armada: Clarify control registers accesses
thermal: armada: Simplify the check of the validity bit
thermal: armada: Use msleep for long delays
dt-bindings: thermal: Describe Armada AP806 and CP110
dt-bindings: thermal: rcar: Add device tree support for r8a7743
thermal: mtk: Cleanup unused defines
thermal: imx: update to new formula according to NXP AN5215
thermal: imx: use consistent style to write temperatures
thermal: imx: improve comments describing algorithm for temp calculation
...
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
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Add compatible strings for AP806 and CP110 that are part of the Armada
8k/7k line of SoCs.
Add a note on the differences in the size of the control area in
different bindings. This is an existing difference between the Armada
375 binding and the other boards already supported. The new AP806 and
CP110 bindings are similar to the existing Armada 375 in this regard.
Signed-off-by: Baruch Siach <baruch@tkos.co.il>
[<miquel.raynal@free-electrons.com>: reword, additional details]
Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add thermal sensor support for r8a7743 SoC. The Renesas RZ/G1M
(r8a7743) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Simon Horman <simon.horman@netronome.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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DT unit addresses should be lower case hex. Fix all the
binding examples.
Converted with the following command from Krzysztof Kozlowski:
sed -e 's/@\([a-fA-F0-9_-]*\) {/@\L\1 {/' -i $(find Documentation/devicetree/bindings -name '*.txt')
Signed-off-by: Rob Herring <robh@kernel.org>
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