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| author | Kunihiko Hayashi <hayashi.kunihiko@socionext.com> | 2023-02-20 14:50:28 +0900 |
|---|---|---|
| committer | Marek Vasut <marex@denx.de> | 2023-02-22 19:40:11 +0100 |
| commit | ef2313b8a26e83c92a14b43b3b3bb1c7af017d98 (patch) | |
| tree | 0a76117d333bf595c733e1a9ca154e6d9e080fdb /lib/tpm_api.c | |
| parent | 7c71c684ce697dcb79efb7f027d820a6ab82228b (diff) | |
usb: dwc3-generic: Export glue structures and functions
In order to allow external SoC-dependent glue drivers to use dwc3-generic
functions, push the glue structures and export the functions to a header
file.
The exported structures and functions are:
- struct dwc3_glue_data
- struct dwc3_glue_ops
- dwc3_glue_bind()
- dwc3_glue_probe()
- dwc3_glue_remove()
The SoC-dependent glue drivers can only define their own wrapper driver
and specify these functions. The drivers can also add their own compatible
strings and configure functions.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Reviewed-by: Marek Vasut <marex@denx.de>
Diffstat (limited to 'lib/tpm_api.c')
0 files changed, 0 insertions, 0 deletions