Merge tag 'thermal-v7.4-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull updates of thermal drivers for 7.4-rc1 from Daniel Lezcano:

"- Add the Exynos ACPM thermal driver for Google GS101, along with
   DT bindings and a MAINTAINERS entry (Tudor Ambarus)

 - Add Renesas RZ/G3L thermal sensor support and DT bindings, and move
   default calibration values to per-SoC match data (Biju Das)

 - Add Qualcomm MSM8952 TSENS support and the corresponding DT binding
   compatible (Muzaffer Kadir)

 - Document the Qualcomm PMAU0102 Master BandGap temperature monitor
   compatible in the DT bindings (Dhruvin Rajpura)

 - Extend the QCom TSENS v2 trip temperature limits to the hardware
   range of -204°C to +204°C to prevent interrupt storms when operating
   beyond the previous software limits (Priyansh Jain)

 - Fix temperature threshold map indexing in the QCom SPMI temperature
   alarm driver to prevent out-of-bounds reads (Georgi Djakov)

 - Describe the additional bus clock required by the Amlogic T7 thermal
   sensor and switch the driver to the clk_bulk API to manage multiple
   clocks (Ronald Claveau)

 - Request the Airoha EN7581 IRQ after thermal zone registration to
   prevent the interrupt handler from accessing an unregistered or
   already freed thermal zone (Vitaliy Sochnev)

 - Fix the Airoha AN7583 ADC mux field mapping, serialize access to the
   shared ADC, and verify mux selection to avoid invalid temperature
   readings and spurious critical shutdowns (Vitaliy Sochnev)

 - Register separate thermal zones for the AN7583 bandgap, GbE and CPU
   sensors, and update the DT bindings to use one thermal sensor cell
   to select the sensor (Vitaliy Sochnev)

 - Fix signed integer overflow in the Renesas RZ/G3E temperature-to-code
   conversion, preserve compare interrupt state across runtime PM,
   and prevent overlapping temperature conversions (Ovidiu Panait)

 - Remove redundant trip window validation and runtime PM
   pm_runtime_mark_last_busy() calls from the Renesas RZ/G3E driver
   (Ovidiu Panait)

 - Propagate reset assertion failures from Renesas RZ/G3E suspend and
   attempt to restore power if the sensor was active (Pengpeng Hou)

 - Stop the TI bandgap alert IRQ before removing sensor interfaces and
   cancel pending alert work to prevent use-after-free on driver removal
   (Weigang He)

 - Validate Spreadtrum sensor IDs read from the device tree before using
   them for register offsets and array indexing (Weigang He)

 - Convert the TI OMAP bandgap DT bindings to schema and document the
   DRA752 compatible and thermal sensor cells (Bhargav Joshi)

 - Use DT property helpers matching the signed temperature and unsigned
   hysteresis types defined by the thermal zone bindings (Rob Herring)

 - Reuse common error handling code in the power allocator governor
   bind callback (Markus Elfring)

 - Constify the thermal zone device operations in the i.MX9 driver
   (Christophe JAILLET)

 - Fix kernel-doc parameter names and firmware node references in the
   cooling device registration helpers (Aryan Sinha)

 - Correct the documented return value of ti_bandgap_get_sensor_data()
   to describe validation errors and potentially NULL stored data
   (Karl Mehltretter)

 - Ensure NUL-termination when copying the cooling device command-line
   argument in tmon and fix the associated string truncation warning
   (Florian Fainelli)

 - Fix undefined behavior caused by a signed shift in the tmon thermal
   zone binding display (Liu Jing)

 - Fix wording in tmon comments (Hemanth Selam)"

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