mtd: spi-nor: winbond: Prepare introduction of W25QxxPW-Q/N parts

There is an ID collision between chips of same density from the JW
family (which it self conflicted with yet another family) with new PW
parts. Chips are very similar in practice, it is mostly a matter of
electrical differences (mostly power consumption being lower) as well as
the addition of inline ECC capability for the higher devices (> 32Mb).

Chips with ECC capability protect 16 bytes chunks are against single
errors. In case a non-aligned write happens, ECC is locally disabled
until the next erase.

Another significant difference is that PW chips identify themselves as
supporting the new SFDP (rev F) QER field which forces an alternate
write SR2 opcode (0x31).

Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Michael Walle <mwalle@kernel.org>

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