mtd: spi-nor: winbond: Add support for W25Q33PW-Q/N

There is an ID collision with chips of same density from the JW family
(which it self conflicted with yet another family). Chips are very
similar in practice, it is mostly a matter of electrical differences
(mostly power consumption being lower) as well as the addition of inline
ECC capability.

Unlike the other (bigger) densities from the PW family, this part has no
ECC support.

Another significant difference is that PW chips identify themselves as
supporting the new SFDP (rev F) QER field which forces an alternate
write SR2 opcode (0x31).

Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Michael Walle <mwalle@kernel.org>

0 files changed, 0 insertions, 0 deletions