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authorSachin Gupta <sachin.gupta@oss.qualcomm.com>2026-08-14 15:21:25 +0530
committerBjorn Andersson <andersson@kernel.org>2026-08-31 11:16:06 -0500
commit739cc0db96cc2bd0da3a805aa96cd8c92d56cbdc (patch)
treed31389c17d41879d25170c6fc3634b8e5d9f1a9a /tools/perf/scripts/python
parentcd0f33393882e2554d46e8e068ab95d00593f385 (diff)
arm64: dts: qcom: lemans-pmics: Enable PMIC MBG thermal monitor
Lemans boards use PM8654AU PMIC instances that expose MBG thermal monitor blocks handled by the existing qcom-spmi-mbg-tm driver. Add MBG temperature-sensor nodes for the PMIC instances and wire them into dedicated thermal zones with passive trips, so PMIC die temperature monitoring is available through the thermal framework. Signed-off-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Link: https://lore.kernel.org/r/6a7ee538.797536ea.65c65.28c0@mx.google.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
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