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git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd
Pull MFD updates from Lee Jones:
"Core:
- Add a resource-managed version of alloc_workqueue()
(`devm_alloc_workqueue()`)
- Preserve the Open Firmware (OF) node when an ACPI handle
is present
Apple SMC:
- Wire up the Apple SMC power driver by adding a new MFD cell
Atmel HLCDC:
- Fetch the LVDS PLL clock as a fallback if the generic sys_clk
is unavailable
Broadcom BCM2835 PM:
- Add support for the BCM2712 power management device
- Introduce a hardware type identifier to distinguish SoC variants
Congatec CGBC, KEMPLD, RSMU, Si476x:
- Fix various kernel-doc warnings and correct struct member names
DLN2:
- Drop redundant USB device references and switch to managed
resource allocations
- Update bare 'unsigned' types to 'unsigned int'
ENE KB3930:
- Use the of_device_is_system_power_controller() wrapper
EZX PCAP:
- Avoid rescheduling after destroying the workqueue by switching
to a device-managed workqueue
- Drop redundant memory allocation error messages
- Return directly instead of using empty goto statements
Freescale i.MX25 TSADC:
- Convert devicetree bindings from TXT to YAML format
Freescale MC13xxx:
- Fix a memory leak in subdevice platform data allocation by
using devm_kmemdup()
Intel LPC ICH:
- Expose a software node for the GPIO controller cell to fix
GPIO lookups
Intel LPSS:
- Add PCI IDs for the Intel Nova Lake-H platform
Maxim MAX77620:
- Convert devicetree bindings from TXT to YAML format
- Document an optional I2C address for the MAX77663 RTC device
Maxim MAX77705:
- Make the max77705_pm_ops variable static to resolve a
sparse warning
MediaTek MT6397:
- Correct the hardware CIDs for the MT6328, MT6331, and MT6332
PMICs to allow proper driver binding
ROHM BD71828:
- Enable system wakeup via the power button
ROHM BD72720:
- Add a new compatible string for the ROHM BD73900 PMIC
SpacemiT P1:
- Drop the deprecated "vin-supply" property from the devicetree
bindings
- Add individual regulator supply properties to match actual
hardware topology
STMicroelectronics STPMIC1:
- Attempt system shutdown a second time to handle transient I2C
communication failures
Viperboard:
- Drop redundant USB device references"
* tag 'mfd-next-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (28 commits)
mfd: core: Preserve OF node when ACPI handle is present
mfd: ene-kb3930: Use of_device_is_system_power_controller() wrapper
mfd: intel-lpss: Add Intel Nova Lake-H PCI IDs
dt-bindings: mfd: max77620: Document optional RTC address for MAX77663
dt-bindings: mfd: max77620: Convert to DT schema
mfd: ezx-pcap: Avoid rescheduling after destroying workqueue
mfd: ezx-pcap: Return directly instead of empty gotos
mfd: ezx-pcap: Drop memory allocation error message
mfd: bcm2835-pm: Add BCM2712 PM device support
mfd: bcm2835-pm: Introduce SoC-specific type identifier
dt-bindings: mfd: bd72720: Add ROHM BD73900
mfd: si476x: Fix kernel-doc warnings
mfd: rsmu: Remove a empty kernel-doc line
mfd: kempld: Fix kernel-doc struct member names
mfd: congatec: Fix kernel-doc struct member names
dt-bindings: mfd: Convert fsl-imx25-tsadc.txt to yaml format
mfd: viperboard: Drop redundant device reference
mfd: dln2: Switch to managed resources and fix bare unsigned types
mfd: macsmc: Wire up Apple SMC power driver
mfd: mt6397: Properly fix CID of MT6328, MT6331 and MT6332
...
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Cleanup of the reserved memory code to keep CMA specifics in CMA
code
- Add and convert several users to new of_machine_get_match() helper
- Validate nul termination in string properties
- Update dtc to upstream v1.7.2-69-g53373d135579
- Limit matching reserved memory devices to /reserved-memory nodes
- Fix some UAF in unittests
- Remove Baikal SoC bus driver
- Fix false DT_SPLIT_BINDING_PATCH checkpatch warning
- Allow fw_devlink device-tree on x86
- Fix kerneldoc return description for of_property_count_elems_of_size()
DT bindings:
- Add fsl,imx25-aips, fsl,imx25-tcq, qcom,eliza-pdc,
qcom,eliza-spmi-pmic-arb, qcom,hawi-imem, qcom,milos-imem,
qcom,hawi-pdc, and lg,sw49410 bindings
- Convert arm,vexpress-scc to DT schema
- Deprecate Qualcomm generic CPU compatibles. Add Apple M3 CPU cores.
- Move some dual-link display panels to the dual-link schema
- Drop mux controller node name constraints
- Remove Baikal SoC bus bindings
- Fix a false warning in the thermal trip node binding"
* tag 'devicetree-for-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits)
dt-bindings: display: panel: panel-simple: Add lg,sw49410 compatible
dt-bindings: display: ti, am65x-dss: Fix AM62L DSS reg and clock constraints
dt-bindings: display: simple: Move Innolux G156HCE-L01 panel to dual-link
dt-bindings: display: simple: Move AUO 21.5" FHD to dual-link
dt-bindings: thermal: Fix false warning with 'phandle' in trips nodes
of: unittest: fix use-after-free in testdrv_probe()
of: unittest: fix use-after-free in of_unittest_changeset()
dt-bindings: qcom,pdc: document the Hawi Power Domain Controller
dt-bindings: ARM: arm,vexpress-scc: convert to DT schema
drivers/of: fdt: validate flat DT string properties before string use
drivers/of: fdt: validate stdout-path properties before parsing them
dt-bindings: sram: Document qcom,hawi-imem compatible
dt-bindings: sram: Allow multiple-word prefixes to sram subnode
dt-bindings: sram: Document qcom,milos-imem
scripts/dtc: Update to upstream version v1.7.2-69-g53373d135579
of: property: Allow fw_devlink device-tree on x86
dt-bindings: arm: cpus: Add Apple M3 CPU core compatibles
dt-bindings: display: lt8912b: Drop redundant endpoint properties
dt-bindings: opp-v2: Fix example 3 CPU reg value
dt-bindings: connector: add pd-disable dependency
...
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A pattern property matching essentially anything doesn't work if there
are implicit properties such as 'phandle' which can occur on any node.
One such example popped up recently:
arch/arm64/boot/dts/qcom/sm8650-hdk.dtb: thermal-zones: gpuss0-thermal:trips:phandle: 531 is not of type 'object'
from schema $id: http://devicetree.org/schemas/thermal/thermal-zones.yaml
Instead of a pattern property, use an "additionalProperties" schema
instead which is the fallback in case of no matching property.
Link: https://patch.msgid.link/20260410223601.1487473-2-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Convert the SPEAr Thermal Sensor bindings to DT schema.
Signed-off-by: Gopi Krishna Menon <krishnagopi487@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://patch.msgid.link/20260329123449.309814-2-krishnagopi487@gmail.com
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Document the compatible for Qualcomm Eliza SoC TSENS module, fully
compatible with TSENS v2 generation (e.g. SM8650).
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260327100733.365573-2-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Convert max77620 Device Tree bindings from TXT to YAML format. This patch
does not change any functionality; the bindings remain the same. The
thermal bindings are incorporated into the binding. GPIO controller
function in MAX77620 has no dedicated node and is folded into the parent
node itself.
Signed-off-by: Svyatoslav Ryhel <clamor95@gmail.com>
Acked-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20260312085258.11431-4-clamor95@gmail.com
Signed-off-by: Lee Jones <lee@kernel.org>
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Document the Temperature Sensor (TSENS) on the SM8750 SoC.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260313-sm8750_tsens-v1-1-250fcc3794a2@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Document the SDM670 LMh.
Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260310002037.1863-3-mailingradian@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Add the compatible for the thermal sensors on the SDM670.
Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260310002037.1863-2-mailingradian@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs include a
Temperature Sensor Unit (TSU). The device provides real-time temperature
measurements for thermal management, utilizing a single dedicated
channel for temperature sensing.
Compared to the previously supported RZ/G3E, the RZ/T2H and RZ/N2H SoCs
do not have a reset for the TSU peripheral, and the OTP data is exposed
via ARM SMC, as opposed to a system register.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@renesas.com>
Link: https://patch.msgid.link/20260108195223.193531-5-cosmin-gabriel.tanislav.xa@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Renesas RZ/V2N SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The device provides real-time
temperature measurements for thermal management, utilizing two dedicated
channels for temperature sensing.
The Renesas RZ/V2N SoC is using the same TSU IP found on the RZ/G3E SoC,
the only difference being that it has two channels instead of one.
Add new compatible string "renesas,r9a09g056-tsu" for RZ/V2N and use
"renesas,r9a09g047-tsu" as a fallback compatible to indicate hardware
compatibility with the RZ/G3E implementation.
Signed-off-by: Ovidiu Panait <ovidiu.panait.rb@renesas.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://patch.msgid.link/20251209091115.8541-2-ovidiu.panait.rb@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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MT7987
Add thermal controller definition for MT7987.
Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20251223175710.25850-2-linux@fw-web.de
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add LVTS thermal controller binding for MediaTek MT8196.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Tested-by: Frank Wunderlich <frank-w@public-files.de>
Signed-off-by: Laura Nao <laura.nao@collabora.com>
Link: https://patch.msgid.link/20251125-mt8196-lvts-v4-v5-1-6db7eb903fb7@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT bindings:
- Convert lattice,ice40-fpga-mgr, apm,xgene-storm-dma,
brcm,sr-thermal, amazon,al-thermal, brcm,ocotp, mt8173-mdp, Actions
Owl SPS, Marvell AP80x System Controller, Marvell CP110 System
Controller, cznic,moxtet, and apm,xgene-slimpro-mbox to DT schema
format
- Add i.MX95 fsl,irqsteer, MT8365 Mali Bifrost GPU, Anvo ANV32C81W
EEPROM, and Microchip pic64gx PLIC
- Add missing LGE, AMD Seattle, and APM X-Gene SoC platform
compatibles
- Updates to brcm,bcm2836-l1-intc, brcm,bcm2835-hvs, and bcm2711-hdmi
bindings to fix warnings on BCM2712 platforms
- Drop obsolete db8500-thermal.txt
- Treewide clean-up of extra blank lines and inconsistent quoting
- Ensure all .dtbo targets are applied to a base .dtb
- Speed up dt_binding_check by skipping running validation on empty
examples
DT core:
- Add of_machine_device_match() and of_machine_get_match_data()
helpers and convert users treewide
- Fix bounds checking of address properties in FDT code. Rework the
code to have a single implementation of the bounds checks.
- Rework of_irq_init() to ignore any implicit interrupt-parent (i.e.
in a parent node) on nodes without an interrupt. This matches the
spec description and fixes some RISC-V platforms.
- Avoid a spurious message on overlay removal
- Skip DT kunit tests on RISCV+ACPI"
* tag 'devicetree-for-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (55 commits)
dt-bindings: kbuild: Skip validating empty examples
dt-bindings: interrupt-controller: brcm,bcm2836-l1-intc: Drop interrupt-controller requirement
dt-bindings: display: Fix brcm,bcm2835-hvs bindings for BCM2712
dt-bindings: display: bcm2711-hdmi: Add interrupt details for BCM2712
of: Skip devicetree kunit tests when RISCV+ACPI doesn't populate root node
soc: tegra: Simplify with of_machine_device_match()
soc: qcom: ubwc: Simplify with of_machine_get_match_data()
powercap: dtpm: Simplify with of_machine_get_match_data()
platform: surface: Simplify with of_machine_get_match_data()
irqchip/atmel-aic: Simplify with of_machine_get_match_data()
firmware: qcom: scm: Simplify with of_machine_device_match()
cpuidle: big_little: Simplify with of_machine_device_match()
cpufreq: sun50i: Simplify with of_machine_device_match()
cpufreq: mediatek: Simplify with of_machine_get_match_data()
cpufreq: dt-platdev: Simplify with of_machine_get_match_data()
of: Add wrappers to match root node with OF device ID tables
dt-bindings: eeprom: at25: Add Anvo ANV32C81W
of/reserved_mem: Simplify the logic of __reserved_mem_alloc_size()
of/reserved_mem: Simplify the logic of fdt_scan_reserved_mem_reg_nodes()
of/reserved_mem: Simplify the logic of __reserved_mem_reserve_reg()
...
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Commit 1ee90870ce79 ("dt-bindings: thermal: tsens: Add QCS8300
compatible") uses a tab character which is illegal in YAML (at the
beginning of a line). The original patch was correct, so this got
corrupted when applied.
Fixes: 1ee90870ce79 ("dt-bindings: thermal: tsens: Add QCS8300 compatible")
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
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Add bindings documentation for i.MX91 thermal modules.
Signed-off-by: Pengfei Li <pengfei.li_1@nxp.com>
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251020-imx91tmu-v7-1-48d7d9f25055@nxp.com
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Add compatibility string for the thermal sensors on QCS8300 platform.
Signed-off-by: Gaurav Kohli <quic_gkohli@quicinc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Reviewed-by: Akhil P Oommen <akhilpo@oss.qualcomm.com>
Link: https://patch.msgid.link/20250822042316.1762153-2-quic_gkohli@quicinc.com
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The tsens IP found in the IPQ5018 SoC should not use qcom,tsens-v1 as
fallback since it has no RPM and, as such, must deviate from the
standard v1 init routine as this version of tsens needs to be explicitly
reset and enabled in the driver.
So let's make qcom,ipq5018-tsens a standalone compatible in the bindings.
Fixes: 77c6d28192ef ("dt-bindings: thermal: qcom-tsens: Add ipq5018 compatible")
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: George Moussalem <george.moussalem@outlook.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://patch.msgid.link/20250818-ipq5018-tsens-fix-v1-1-0f08cf09182d@outlook.com
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The binding is already defined in mfd/stericsson,db8500-prcmu.yaml and none
of 'the tripN.*' properties appear to be in use.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20251030195234.439141-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Convert the brcm,sr-thermal binding to DT schema format. It's a
straight-forward conversion. "polling-delay", "thermal-sensors", and
"temperature" all apply to the thermal zones, not the sensor node.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251013215810.783006-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Convert amazon,al-thermal binding to DT schema format. It's a
straight-forward conversion.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251013215820.783272-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Document the Temperature Sensor (TSENS) on the Kaanapali Platform.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@oss.qualcomm.com>
Signed-off-by: Jingyi Wang <jingyi.wang@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251021-b4-knp-tsens-v2-1-7b662e2e71b4@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Renesas RZ/V2H SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The device provides real-time
temperature measurements for thermal management, utilizing two dedicated
channels for temperature sensing.
The Renesas RZ/V2H SoC is using the same TSU IP found on the RZ/G3E SoC,
the only difference being that it has two channels instead of one.
Add new compatible string "renesas,r9a09g057-tsu" for RZ/V2H and use
"renesas,r9a09g047-tsu" as a fallback compatible to indicate hardware
compatibility with the RZ/G3E implementation.
Signed-off-by: Ovidiu Panait <ovidiu.panait.rb@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251020143107.13974-3-ovidiu.panait.rb@renesas.com
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Update dtc to upstream version v1.7.2-35-g52f07dcca47c
- Add stub for of_get_next_child_with_prefix()
- Convert of_msi_map_id() callers to of_msi_xlate()
DT bindings:
- Convert multiple text board bindings to DT schema format
- Add bindings for synaptics,synaptics_i2c touchscreen controller,
innolux,n133hse-ea1 and nlt,nl12880bc20-spwg-24 displays, and NXP
vf610 reboot controller
- Add new Arm Cortex-A320/A520AE/A720AE and C1-Nano/Pro/Premium/Ultra
CPUs. Add missing Applied Micro CPU compatibles. Add pu-supply and
fsl,soc-operating-points properties for CPU nodes.
- Add QCom Glymur PDC and tegra264-agic interrupt controllers
- Add samsung,exynos8890-mali GPU to Arm Mali Midgard
- Drop Samsung S3C2410 display related bindings
- Allow separate DP lane and AUX connections in dp-connector
- Add some missing, undocumented vendor prefixes
- Add missing '#address-cells' properties in interrupt controller
bindings which dtc now warns about
- Drop duplicate socfpga-sdram-edac.txt, moxa,moxart-watchdog.txt,
fsl/mpic.txt, ti,opa362.txt, and cavium-thunder2.txt legacy text
bindings which are already covered by existing schemas.
- Various binding fixes for Mediatek platforms in mailbox, regulator,
pinctrl, timer, and display
- Drop work-around for yamllint quoting of values containing ','
- Various spelling, typo, grammar, and duplicated words fixes in DT
bindings and docs
- Add binding guidelines for defining properties at top level of
schemas, lack of node name ABI, and usage of simple-mfd"
* tag 'devicetree-for-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (81 commits)
dt-bindings: arm: altera: Drop socfpga-sdram-edac.txt
dt-bindings: gpu: Convert nvidia,gk20a to DT schema
dt-bindings: rng: sparc_sun_oracle_rng: convert to DT schema
dt-bindings: vendor-prefixes: update regex for properties without a prefix
dt-bindings: display: bridge: convert megachips-stdpxxxx-ge-b850v3-fw.txt to yaml
scripts: dt_to_config: fix grammar and a typo in --help text
dt-bindings: fix spelling, typos, grammar, duplicated words
docs: dt: fix grammar and spelling
of: base: Add of_get_next_child_with_prefix() stub
dt-bindings: trivial-devices: Add compatible string synaptics,synaptics_i2c
dt-bindings: soc: mediatek: pwrap: Add power-domains property
dt-bindings: pinctrl: mt65xx: Allow gpio-line-names
dt-bindings: media: Convert MediaTek mt8173-vpu bindings to DT schema
dt-bindings: arm: mediatek: Support mt8183-audiosys variant
dt-bindings: mailbox: mediatek,gce-mailbox: Make clock-names optional
dt-bindings: regulator: mediatek,mt6331: Add missing compatible
dt-bindings: regulator: mediatek,mt6331: Fix various regulator names
dt-bindings: regulator: mediatek,mt6332-regulator: Add missing compatible
dt-bindings: pinctrl: mediatek,mt7622-pinctrl: Add missing base reg
dt-bindings: pinctrl: mediatek,mt7622-pinctrl: Add missing pwm_ch7_2
...
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Document the Temperature Sensor (TSENS) on Glymur Platform.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Signed-off-by: Pankaj Patil <pankaj.patil@oss.qualcomm.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250920123631.281153-1-pankaj.patil@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Renesas RZ/G3E SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The device provides real-time
temperature measurements for thermal management, utilizing a single
dedicated channel (channel 1) for temperature sensing.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Link: https://lore.kernel.org/r/20250917170202.197929-2-john.madieu.xa@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Instead of having an optional rockchip,grf property, forbid using it on
platforms without registers in a GRF being needed for thermal monitoring
and make it mandatory on the platforms actually needing it.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Reviewed-by: Dragan Simic <dsimic@manjaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20250820-thermal-rockchip-grf-warning-v2-3-c7e2d35017b8@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Renesas RZ/G3S SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The temperature is measured using
the RZ/G3S ADC, with a dedicated ADC channel directly connected to the TSU.
Add documentation for it.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20250810122125.792966-2-claudiu.beznea.uj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Document SOCTHERM Thermal Management System found in the Tegra 4 SoC.
Signed-off-by: Svyatoslav Ryhel <clamor95@gmail.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250828055104.8073-3-clamor95@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add compatibility string for the thermal sensors on QCS615 platform.
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Gaurav Kohli <quic_gkohli@quicinc.com>
Link: https://lore.kernel.org/r/20250624064945.764245-2-quic_gkohli@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Convert the Marvell Armada AP80x/CP110 thermal binding to schema. It is
a straight forward conversion.
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20250822225701.766947-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Convert the Marvell Armada 3xx/XP thermal binding to schema.
Drop the AP80x and CP110 as they have long been deprecated and have
been replaced by a new binding.
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20250822225645.766397-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Add the compatible string for Tegra210B01 SOC_THERM
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Aaron Kling <webgeek1234@gmail.com>
Link: https://lore.kernel.org/r/20250720-t210b01-v2-5-9cb209f1edfc@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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and MT8516
The ‘mediatek,mt7981-thermal’ and ‘mediatek,mt8516-thermal’ strings
aren't definied in the driver. Both should have fallback compatible
strings. This commit fixes this issue.
Fixes: 788494ba0999 ("dt-bindings: thermal: convert Mediatek Thermal to the json-schema")
Signed-off-by: Aleksander Jan Bajkowski <olek2@wp.pl>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rafał Miłecki <rafal@milecki.pl>
Link: https://lore.kernel.org/r/20250712195904.6988-2-olek2@wp.pl
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Document the Temperature Sensor (TSENS) on the Milos SoC.
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250713-sm7635-fp6-initial-v2-8-e8f9a789505b@fairphone.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Several Rockchip SoCs, such as the RK3576, can store calibration trim
data for thermal sensors in OTP cells. This capability should be
documented.
Such a rockchip thermal sensor may reference cell handles that store
both a chip-wide trim for all the sensors, as well as cell handles
for each individual sensor channel pointing to that specific sensor's
trim value.
Additionally, the thermal sensor may optionally reference cells which
store the base in terms of degrees celsius and decicelsius that the trim
is relative to.
Each SoC that implements this appears to have a slightly different
combination of chip-wide trim, base, base fractional part and
per-channel trim, so which ones do which is documented in the bindings.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-4-b6e9efbf1015@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add a new compatible for the thermal sensor device on the RK3576 SoC.
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-2-b6e9efbf1015@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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IPQ5018 has tsens v1.0 block with 5 sensors of which 4 are in use
and 1 interrupt.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Sricharan Ramabadhran <quic_srichara@quicinc.com>
Signed-off-by: George Moussalem <george.moussalem@outlook.com>
Link: https://lore.kernel.org/r/DS7PR19MB88835BD1063C4D5451E14B0E9DCC2@DS7PR19MB8883.namprd19.prod.outlook.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add support for Airoha EN7581 thermal sensor and monitor. This is a
simple sensor for the CPU or SoC Package that provide thermal sensor and
trip point for hot low and critical condition to fire interrupt and
react on the abnormal state.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250511185003.3754495-1-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly assorted updates of thermal drivers used on ARM
platforms:
- Use dev_err_probe() helpers to simplify the init code in the Qoriq
thermal driver (Frank Li)
- Power down the Qoriq's TMU at suspend time (Alice Guo)
- Add ipq5332, ipq5424 compatible to the QCom's tsens thermal driver
and TSENS enable / calibration support for V2 (Praveenkumar I)
- Add missing rk3328 mapping entry (Trevor Woerner)
- Remove duplicate struct declaration from the thermal core header
file (Xueqin Luo)
- Disable the monitoring mode during suspend in the LVTS Mediatek
driver to prevent temperature acquisition glitches (Nícolas F. R.
A. Prado)
- Disable Stage 3 thermal threshold in the LVTS Mediatek driver
because it disables the suspend ability and does not have an
interrupt handler (Nícolas F. R. A. Prado)
- Fix low temperature offset interrupt in the LVTS Mediatek driver to
prevent multiple interrupts from triggering when the system is at
its normal functionning temperature (Nícolas F. R. A. Prado)
- Enable interrupts in the LVTS Mediatek driver only on sensors that
are in use (Nícolas F. R. A. Prado)
- Add the BCM74110 compatible DT binding and the corresponding code
to support a chip based on a different process node than previous
chips (Florian Fainelli)
- Correct indentation and style in DTS example (Krzysztof Kozlowski)
- Unify hexadecimal annotatation in the rcar_gen3 driver (Niklas
Söderlund)
- Factor out the code logic to read fuses on Gen3 and Gen4 in the
rcar_gen3 thermal driver (Niklas Söderlund)
- Drop unused driver data from the QCom's spmi temperature alarm
driver (Johan Hovold)"
* tag 'thermal-6.15-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/qcom-spmi-temp-alarm: Drop unused driver data
thermal: rcar_gen3: Reuse logic to read fuses on Gen3 and Gen4
thermal: rcar_gen3: Use lowercase hex constants
dt-bindings: thermal: Correct indentation and style in DTS example
thermal/drivers/brcmstb_thermal: Add support for BCM74110
dt-bindings: thermal: Update for BCM74110
thermal/drivers/mediatek/lvts: Only update IRQ enable for valid sensors
thermal/drivers/mediatek/lvts: Start sensor interrupts disabled
thermal/drivers/mediatek/lvts: Disable low offset IRQ for minimum threshold
thermal/drivers/mediatek/lvts: Disable Stage 3 thermal threshold
thermal/drivers/mediatek/lvts: Disable monitor mode during suspend
thermal: core: Remove duplicate struct declaration
thermal/drivers/rockchip: Add missing rk3328 mapping entry
thermal/drivers/tsens: Add TSENS enable and calibration support for V2
dt-bindings: thermal: tsens: Add ipq5332, ipq5424 compatible
thermal/drivers/qoriq: Power down TMU on system suspend
thermal/drivers/qoriq: Use dev_err_probe() simplify the code
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DTS example in the bindings should be indented with 2- or 4-spaces and
aligned with opening '- |', so correct any differences like 3-spaces or
mixtures 2- and 4-spaces in one binding.
No functional changes here, but saves some comments during reviews of
new patches built on existing code.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250107131027.246608-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Update the binding with the BCM74110 compatible string which denotes the
first device we need to support in a different process node requiring an
updated thermal equation.
Signed-off-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250116193842.758788-2-florian.fainelli@broadcom.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The IPQ5332 and IPQ5424 use TSENS v2.3.3 IP with combined interrupt.
RPM is not available in these SoCs, hence adding new compatible
to have the sensor enablement and calibration function. Also add
nvmem-cell-names.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Manikanta Mylavarapu <quic_mmanikan@quicinc.com>
Link: https://lore.kernel.org/r/20250210120436.821684-2-quic_mmanikan@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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An operating system may allow its user to configure the action to be
undertaken on critical overtemperature events.
However, the bindings currently mandate an absence of the critical-action
property to be equal to critical-action = "shutdown", which would mean any
differing user configuration would violate the bindings.
Resolve this by documenting the absence of the property to mean that the
OS gets to decide.
Link: https://lkml.kernel.org/r/20250217-hw_protection-reboot-v3-10-e1c09b090c0c@pengutronix.de
Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Cc: Benson Leung <bleung@chromium.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Fabio Estevam <festevam@denx.de>
Cc: Guenter Roeck <groeck@chromium.org>
Cc: Jonathan Corbet <corbet@lwn.net>
Cc: Liam Girdwood <lgirdwood@gmail.com>
Cc: Lukasz Luba <lukasz.luba@arm.com>
Cc: Mark Brown <broonie@kernel.org>
Cc: Matteo Croce <teknoraver@meta.com>
Cc: Matti Vaittinen <mazziesaccount@gmail.com>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Rui Zhang <rui.zhang@intel.com>
Cc: Sascha Hauer <kernel@pengutronix.de>
Cc: "Serge E. Hallyn" <serge@hallyn.com>
Cc: Tzung-Bi Shih <tzungbi@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
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Document the ipq6018 temperature sensor, which is used in ipq6018.dtsi
and is compatible with the ipq8074 temperature sensor.
Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240716133803.82907-1-rayyan.ansari@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Document the compatible string for tsens v1.4 block found in MSM8937.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20241113-msm8917-v6-4-c348fb599fef@mainlining.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Document compatible for thermal sensors on Qualcomm SAR2130P platform.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241027-sar2130p-tsens-v1-1-8dee27fc02ae@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Drop duplicate devices in trivial-devices.yaml
- Add a common serial peripheral device schema and reference it in
serial device schemas.
- Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema
- Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc,
isil,isl69260, ti,tps546d24, and lpc32xx DMA mux
- Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
mediatek,mt6795-sys-clock.yaml
- Add arm,gic ESPI and EPPI interrupt type specifiers
- Add another batch of legacy compatible strings which we have no
intention of documenting
- Add dmas/dma-names properties to FSL lcdif
- Fix wakeup-source reference to m8921-keypad.yaml
- Treewide fixes of typos in bindings
DT Core:
- Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429
- More conversions to scoped iterators and __free() initializer
- Handle overflows in address resources on 32-bit systems
- Extend extracting compatible strings in sources from function
parameters
- Use of_property_present() in DT unittest
- Clean-up of_irq_to_resource() to use helpers
- Support #msi-cells=<0> in of_msi_get_domain()
- Improve the kerneldoc for of_property_match_string()
- kselftest: Ignore nodes that have ancestors disabled"
* tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (59 commits)
dt-bindings: watchdog: Add rockchip,rk3576-wdt compatible
dt-bindings: cpu: Drop duplicate nvidia,tegra186-ccplex-cluster.yaml
dt-bindings: clock: mediatek: Drop duplicate mediatek,mt6795-sys-clock.yaml
of/irq: Use helper to define resources
of/irq: Make use of irq_get_trigger_type()
dt-bindings: clk: vc5: Make SD/OE pin configuration properties not required
drivers/of: Improve documentation for match_string
of: property: Do some clean up with use of __free()
dt-bindings: watchdog: qcom-wdt: document support on SA8255p
dt-bindings: interrupt-controller: fsl,irqsteer: Document fsl,imx8qm-irqsteer
dt-bindings: interrupt-controller: arm,gic: add ESPI and EPPI specifiers
dt-bindings: dma: Add lpc32xx DMA mux binding
dt-bindings: trivial-devices: Drop duplicate "maxim,max1237"
dt-bindings: trivial-devices: Drop duplicate LM75 compatible devices
dt-bindings: trivial-devices: Deprecate "ad,ad7414"
dt-bindings: trivial-devices: Drop incorrect and duplicate at24 compatibles
dt-bindings: wakeup-source: update reference to m8921-keypad.yaml
dt-bindings: interrupt-controller: qcom-pdc: document support for SA8255p
dt-bindings: Fix various typos
of: address: Unify resource bounds overflow checking
...
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Corrected several typos in Documentation/devicetree/bindings files.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Kuan-Wei Chiu <visitorckw@gmail.com>
Reviewed-by: Matti Vaittinen <mazziesaccount@gmail.com>
Signed-off-by: Yu-Chun Lin <eleanor15x@gmail.com>
Link: https://lore.kernel.org/r/20240905151943.2792056-1-eleanor15x@gmail.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Add compatible for sensors representing support on SA8255p.
Signed-off-by: Nikunj Kela <quic_nkela@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240828203721.2751904-14-quic_nkela@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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