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| author | Sam Protsenko <semen.protsenko@linaro.org> | 2025-07-09 17:29:19 -0500 |
|---|---|---|
| committer | Minkyu Kang <mk7.kang@samsung.com> | 2025-07-25 10:17:21 +0900 |
| commit | ba713dd7d4d8da282562becfefcd974d8344c6f5 (patch) | |
| tree | 4896c4072616344831f8c9418682be7cbb12eabb /drivers/fpga/ivm_core.c | |
| parent | 80c1606d13c2f38cba10e803c0225c3e5a1bdaac (diff) | |
usb: dwc3-generic: Add Exynos850 support
The only thing needed from DWC3 glue layer for Exynos850 is to enable
USB clocks. The generic glue layer driver already does that. Add
Exynos850 dwc3 compatible string to enable support for this chip.
Signed-off-by: Sam Protsenko <semen.protsenko@linaro.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@kernel.org>
Signed-off-by: Minkyu Kang <mk7.kang@samsung.com>
Diffstat (limited to 'drivers/fpga/ivm_core.c')
0 files changed, 0 insertions, 0 deletions