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| author | Tom Rini <trini@konsulko.com> | 2025-07-09 08:40:36 -0600 |
|---|---|---|
| committer | Tom Rini <trini@konsulko.com> | 2025-07-09 08:40:36 -0600 |
| commit | 971bd7614c5df1b77063fab9b0a5cae6afc77d3b (patch) | |
| tree | f556bc0a56e611b08c54febbc4fb79fed8d131c4 /drivers/pwm/pwm-ti-ehrpwm.c | |
| parent | 074e05952705972072f52128cf2e3ec2d8f35de6 (diff) | |
| parent | a03f4a632bf7c2337586394e5e7db6b368cfb37f (diff) | |
Merge patch series "Improve Verdin AM62P thermal setup by generalizing ft_board_setup_ex()"
João Paulo Gonçalves <jpaulo.silvagoncalves@gmail.com> says:
In some use cases, board-specific device tree changes must not be overwritten
by system fixups. Although U-Boot provides ft_board_setup_ex() for this
purpose, it is currently only used on TI Keystone. This series makes
ft_board_setup_ex() a generic option, allowing its use by other architectures
and boards.
Additionally, considering that Toradex Verdin-AM62P hardware lifetime
guarantees are based on a 105°C junction temperature (while TI AM62Px supports
up to 125°C), this series implements necessary changes within TI K3 AM62P and
Toradex board code. These changes include exporting common fixup device Tree
functions used in TI K3 for board-code access and also fixup for AM62P thermal
zones to correctly reflect the number of CPU nodes according to the SoC part
number.
Link: https://lore.kernel.org/r/20250623-am62p-fdt-fixup-trip-points-v1-0-12355eb6a72f@toradex.com
Diffstat (limited to 'drivers/pwm/pwm-ti-ehrpwm.c')
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