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authorNeha Malcom Francis <n-francis@ti.com>2023-07-22 00:14:26 +0530
committerTom Rini <trini@konsulko.com>2023-07-21 19:36:58 -0400
commit9b03bfe105a27d9e84867c8d72209b30b753565d (patch)
tree7b8e15b6f9454263fec82a7296d4f03497422948 /lib/linux_string.c
parent78144826bb8209df0a703a4a0dd88f7b57ad12cb (diff)
arm: dts: k3: Add support for packaging sysfw.itb and tiboot3.bin
Board config binary artifacts must be generated to be used by binman to package sysfw.itb and tiboot3.bin for all K3 devices. For devices that follow combined flow, these board configuration binaries must again be packaged into a combined board configuration blobs to be used by binman to package tiboot3.bin. Add common k3-binman.dtsi to generate all the board configuration binaries needed. Also add custMpk.pem and ti-degenerate-key.pem needed for signing GP and HS bootloader images common to all K3 devices. Reviewed-by: Simon Glass <sjg@chromium.org> Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
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